Europe

08/01/1997

Europe

BE Semiconductor Industries (BESI), Zevenaar, The Netherlands, L. Possehl & Co., and Mr. Ho Hun Tak have finalized an agreement to form Possehl BESI Electronics NV (PBE), a new joint venture for lead frame production and plating. Under the agreement, Possehl, BESI, and Ho will have 50.1%, 30%, and 19.9% ownership of the company, respectively, and the management board will consist of executive officers from each party. The new company will employ about 1250 people with 14 production facilities in Europe, Asia, the United States, and North Africa.

ASM Lithography (ASML), Veldhoven, The Netherlands, has sold a PAS 2500/40 i-line stepper to Burr-Brown Corp. for its Tucson, AZ, facility. The stepper, which achieves 0.7-?m resolution while processing 70, 150-mm wafers/hr, will be used to manufacture newer generations of precision linear, data conversion, and mixed-signal ICs.

Johnson Matthey plc. (JM), Roysten, England, and Kyocera have agreed to license technology to each other for the packaging of microprocessors and other advanced semiconductors. JM will license its plastic land grid array technology to Kyocera; Kyocera will license its technology for future generations of plastic laminate packages for semiconductors to Johnson Matthey.

STEAG MicroTech, Essen, Germany, has received an order for production and supply of several systems for the new chip factory of White Oak Semiconductor, Richmond, VA.n