CVD technology for 0.18um Design

08/01/1997

Series of g-line steppers

These three new tools, based on the Titan wafer stepper product platform, are widefield steppers for 200-mm g-line lithography. The systems are well-suited to advanced packaging applications, such as photosensitive polyimide for ultrathin packaging and bump processing for flip chip packages. The series features a large DOF, allowing good critical di-mension control and a wide process latitude for processing of both thin and ultrathick films. The tools are available with either a traditional wafer alignment system or pattern recognition-based machine vision systems. Each system offers a high-throughput option of 100 wafers/hour, and they are all backward-compatible with previous generations of steppers from this company. Ultratech Stepper Inc., San Jose, CA; ph 800/222-1213 or 408/321-8835, fax 408/325-6444.