Euro Focus

07/01/1997

IMEC and ASML join forces on 193 nm. IMEC, an independent semiconductor research center, and ASM Lithography (ASML) have jointly launched a cooperative R&D program in 193-nm deep-UV lithography, to take place in IMEC`s Class 1 cleanroom facility at Leuven, Belgium. According to the IMEC newsletter, the purpose of the program is to develop advanced optical processes capable of producing linewidths as small as 0.13 micron. Leading semiconductor manufacturers are invited to participate in the 193-nm development program. It is hoped that by pooling knowledge, all participants will gain early process knowledge beyond today`s 248-nm at a lower cost than individually funded R&D work. In other news, IMEC has extended its exclusive joint research agreement with Ashland Chemical to 2001. The agreement studies high-purity chemicals and processes for semiconductor manufacturing, and includes a program of new product development and investigation of chemical requirements for HF last and IPA vapor drying processing.

To meet increasing demand for tantalum chip capacitors from the PC and automotive electronics industries, Siemens Matsushita Components is investing some DM 100 million in a new plant in Evora, Portugal, to expand its manufacturing capacity. Production is due to ramp up at the end of 1998 with a volume of 740 million capacitors annually. The 7600 square meter plant will employ 360 people in prefabrication, assembly, and testing.

The company will also continue production at its headquarters in Heidenheim, Germany. Through the expansion in manufacturing capacity, the company is creating "the basis for delivering high-grade tantalum chips at competitive prices to profit from the future growth opportunities offered by the market," according to a company spokesman.

VLSI Research has unveiled new survey results that show European semiconductor equipment companies holding the lead in customer satisfaction, outdistancing American and Japanese competitors in most categories, and especially service after sale. VLSI notes that European toolmakers tend to use internal staff for sales and service abroad, rather than rep firms, and also provide software support direct from headquarters. Other secrets to success are tightly focused product definition and marketing, allowing targeting of higher-end, higher-return accounts, and a move toward fewer, larger customers. Europe`s educational systems were also cited as an important factor, as they provide a more stable work force and better access to employee resources. Moreover, the continent has an abundance of well-trained engineers in comparison to the number of high-tech jobs available, the opposite of the situation in Japan and the US.

Turkish fab seeks offshore cooperation as part of a larger privatization effort. A small semiconductor fab in Ankara, Turkey, currently owned by the Turkish government, is undergoing privatization, and is seeking partnerships or a possible sale to a global firm that can provide process technology and marketing.

The TESTAS (Turkish Electronics Industry and Trade Corp.) wafer fab was originally established in 1978, with a technology transfer and licensing deal with Exar Corp., a now-fabless chip company in Fremont, CA. The contract gave TESTAS access to a 10-micron process and 3-in. wafer processing knowledge. Construction was delayed until 1985, however, when Varioplan of Switzerland designed the facility and supervised the building process. Construction was completed in 1990, and pilot production began in 1993; production of small signal transistors has been realized, say TESTAS officials. The fab has a total area of 4500 m2, of which 1000 m2 is Class 100-1000 cleanroom for processing, and 300 m2 Class 1000 test area. An additional 3200 m2 is used for facilities.

A government privatization program and financial constraints are restricting production and test activities at the facility to minimal levels, although the facilities department is running to maintain cleanroom conditions. About 20 technical personnel are on staff. TESTAS officials say they are seeking firms that would be interested in producing devices in the facility. Terms are negotiable, including upgrading of the fab and other conditions.

More information can be obtained by contacting Aysegul Nadar, production planning chief engineer, or Kazim Kucukturhan, assistant plant manager, Semiconductor Group. Mailing address is: TESTAS, Ankara Plant, PO Box 38, EMEK, 06512 Ankara, Turkey; ph 90/312-287-3625; fax 90/312-287-4538; e-mail [email protected].

Cambridge Display Technology Ltd. (CDT) signs light-emitting polymer (LEP) agreements. CDT, a Cambridge, UK, developer of LEP technology for display applications, has signed a technology license agreement with Hoechst Celanese AG, Frankfurt, Germany, and a patent and intellectual property agreement with UNIAX Corp., Santa Barbara, CA. Under the terms of the deal with Hoechst Celanese, CDT will grant licenses on agreed terms to a number of Hoechst`s customers in exchange for an up-front fee from the company. Hoechst manufactures the polymer material fundamental to the construction of an LEP display. The agreement means that the company can provide its key customers with both the core technology to enable them to begin development of LEP displays and access to key patents held by CDT.

In addition, under the agreement with UNIAX, CDT will grant UNIAX access to its global LEP patents and intellectual property. In return, UNIAX will drop its dispute of CDT`s patents and pay a royalty fee on all future products.

European companies open up overseas offices.In order to strengthen its customer services in the Asia-Pacific countries, Philips Analytical X-Ray, of Almelo in The Netherlands, will open up a regional headquarters located in Singapore on July 1. It will focus on sales and support activities for the semiconductor industry.

Also, Lambda Physik, Gottingen, Germany, has recently opened an applications lab at its US headquarters in Ft. Lauderdale, FL. The new facility will enable engineers to test material interaction and new processes using the latest in excimer laser technology.

The lab is equipped with a LAMBDA 4000 high-power and LPX series excimer lasers, Micro/Las micromachining systems with a variety of beam transformation optics, four-axis motion control systems with a variety of beam transformation optics and Nikon microscopes.