Wet Etching

07/01/1997

Wet etching

The Spin Etcher Front Master`s state-of-the-art process and equipment technology allows automatic single-wafer wet chemical processes for backside and frontside wafer treatment. It is used for versatile applications such as oxide removal/thinning using dilute HF, silicon structuring (isotropic etch), and polysilicon etch after poly spacer removal and after poly buffered LOCOS. Yield improvements result from low particle and heavy-metal contamination, high selectivities and etch rates, good uniformities, and low defect density. Sez AG, Villach, Austria; ph 43/4242-204, fax 43/4242-20421.