Issue



Thin film deposition controller


07/01/1997







Wafer processing platform

The Clean Track ACT 8 platform is designed for large-diameter-wafer processing and 0.18-?m lithography. Features include: dual stacked spinner modules; seven-tiered thermal processing units; triple-arm wafer transfer; an optical edge bead removal unit integrated with the stepper interface; coating technologies that reduce consumption of ARCs and chemically amplified resists; and a system layout that eliminates the need for one-axis of movement of the robotic transfer arm. Tokyo Electron America Inc., Austin, TX; ph 512/424-1208, fax 512/424-1039.