Wafer Inspection handling

07/01/1997

Wafer inspection handling

The 5E Dynascope is now integrated with WED`s Microloader or Irvine Optical Corp.`s Ultrastation 3C wafer-transfer systems. Both systems are modular and include handling options to allow measurement of wafer features as well as the Dynascope`s pure inspection capabilities. The Dynascope electronic filar and microprocessor, or displacement measuring stages, may be specified. Throughput of 900 wafers/hour can be achieved. The handlers, each accepting wafers up to 200 mm, offer single-button operation and pre-programmable movement sequences for repetitive inspection and measurement routines. Vision Engineering Ltd., Woking, UK; ph 44/1483-223417, fax 44/1483-248317.