Flip chip underfill dispenser

07/01/1997

Flip chip underfill dispenser

The Universal Dispensing Platform (UDP) incorpoates three (X, Y, Z) or four (q) closed-loop, brushless servo direct drive axes with ball screw technology for high accuracy and repeatabilty. For underfill epoxy dispensing, this platform uses multiple spool or needle valve dispensing heads. The system uses an automatic Cognex vision system with proprietary illumination to locate each die and position the dispense needle at the correct location. Heating of the substrate is achieved using long-life, noncontact closed-loop ceramic heaters in pre-heat, dispense, and post-heat zones. A dynamic touch sensor is used for z-axis height compensation. Application software allows complete flexibility. The platform can accommodate work envelopes from 300 ? 300 mm to 1200 ? 1200 mm. Zmation Inc., Portland, OR; ph 503/654-9793, fax 503/653-5334, e-mail [email protected]