Automated Inspection system

07/01/1997

Automated inspection system

Model 890 automatically inspects wafers and die, and performs package substrate bump inspection. Featuring a very high-resolution 3-D scanning laser, the 890 acquires, analyzes, and displays critical 3-D height information and 2-D grayscale data at a rate of millions of pixels/sec. Measurements performed include ball height, missing ball, ball position, ball volume, coplanarity, regression, and ball diameter. All key components in the high-density, matrix-based package assembly process can be inspected. Among these are wafer inspection after fabrication, individual die inspection after wafer dicing, and inspection of the substrate to which the die will be attached. General Scanning Inc./View Engineering Div., Simi Valley, CA; ph 805/522-8439, fax 805/578-5249, e-mail [email protected].