FSG Film Capability for CVD system

07/01/1997

FSG film capability for CVD system

A fluorinated silicate glass (FSG) film capability has been added to the Aspen CVD system. FSG is a lower dielectric constant (low k) IMD layer. The Aspen CVD system also allows for the deposition of films with nearly perfect SiO2 stoichiometry, a key factor in the production of purer, denser films. FSG has greater surface mobility, providing very good step coverage; this is critical to planarization techniques used in sub-0.5-?m device technologies. FSG implementation operates at low pressures, generating higher-density film with a higher compressive stress control, resulting in stable, higher-density fluorine concentrations. Such higher-density films better address the requirements of SOG encapsulation materials. Mattson Technology Inc., Fremont, CA; ph 510/492-6422, fax 510/657-0165