Post-CMP oxide and tungsten wafer cleaning

06/01/1997

Post-CMP oxide and tungsten wafer cleaning

Model 200 features a double-sided brush scrubbing system that simultaneously cleans both sides of the wafer with a PVA sponge scrub brush. Per step process control is provided for brush squeeze pressure from programmable electronic pressure controllers. The 200 is suitable for brushing with dilute acid solutions compatible with the PVA brush, including HF, HCl, H2SO4, etc. The system enables cleaning capabilities to be used in any sequence. Standard equipment includes one or two sets of double-sided scrub brushes, megasonic scrub, high-pressure scrub, and digital dispensers. Solid State Equipment Corp., Fort Washington, PA; ph 215/643-7900, fax 215/643-7910.