Europe

06/01/1997

Europe

Genus Inc., Sunnyvale, CA, has signed a multimillion dollar contract with European foundry Newport Wafer-Fab Ltd. (NWL), Wales, UK, to develop Genus` MeV ion implant technology. A Genus Tandetron 1520 MeV ion implant system will be delivered to NWL, which will develop Genus` Buried Implanted Layer for Lateral Isolation (BILLI) MeV procedure at its new Fab 2 and Fab 3 in Newport, Wales. The technology will be used first in Fab 2, NWL`s 0.5-?m 150-mm wafer line, and later in Fab 3, NWL`s 0.5- and 0.35-?m 200-mm line.

Honeywell and Dassault Electronique have signed a five-year agreement to establish a European-based ASIC design center for radiation hardened and high-temperature electronics applications. Design engineers at Dassault`s ASIC Design Center near Paris will be trained in the use of Honeywell`s VLSI design system ASIC design tool kit. Dassault will market its design services for Honeywell`s radiation hardened ASICs and high-temperature electronic products.

Austria Mikro Systeme International AG (AMS), UnterpremstYtten, Austria, signed an agreement to purchase the PROMIS manufacturing execution system software for the entire AMS ASIC manufacturing operation. The PROMIS solution will replace AMS`s existing in-house system. AMS has agreed to an option to purchase the new Windows NT-based Encore! Process Composer.

Micronic Laser Systems AB, Taby, Sweden, has received an order for a LRS 1100-30S laser writing system from Sony Corp. The lithography tool will provide improvements in accuracy, resolution, write time, and handling of substrate sizes up to 1100 ? 1100 mm.