Wet chemistry processing system

06/01/1997

Wet chemistry processing system

Interlab announces wet chemistry processing systems for cleaning and etching recovered silicon. Customized systems are capable of cleaning any variety of silicon substrates from poly-silicon chunks to

300-mm reclaim wafers. Using robotic transfer facilities, throughput requirements can be tailored to customer specifications. PLC-based control systems range in complexity from simple repetitive transfer to full parameter monitoring and facility integration. A number of energy-conservation features can be incorporated into the system design, such as Interlab`s proprietary water regeneration system. All systems feature Interlab`s Microdry Series ultrapure drying chambers. All-plastic system construction and HEPA-filtered process environments are available. A nonmetallic process eliminates metal-ion contamination. Interlab Inc., Danbury, CT; ph 203/748-5624.