Process-compatible temperature control

06/01/1997

Process-compatible temperature control

The TCU 40/80 is designed for the cooling of wafers during processes such as etch, providing continuous operation across wide temperature extremes (-40 to +80?C). Features include temperatures set at increments of 0.1?C, adjustable coolant flow of 1-6 gpm, fuzzy logic temperature control, remote temperature sensing capability, and a stainless steel pressurized coolant system. Alarms include 3-phase rotation and low-voltage indication, utilities water, circuit breakers, reservoir coolant level and temperature, coolant flow, compressor trip, and remote RTD. Edwards High Vacuum International, Wilmington, MA; ph 508/658-5410, fax 508/658-7969, URL http://www.edwards.boc.com.