Die taping machine

06/01/1997

Die taping machine

The BMP-230 TMBU-XY die machine is a mid-volume SMD handling and tape and reel tool. It can tape and reel die from wafers at speeds up to 5000 pph. A barcode reader confirms wafer identification, and mapping options verify the picking location of each die. A camera for ink dot recognition confirms that only known good die are placed into tape. Wafers are aligned before die are picked, and placed into tape with a pick accuracy of ?0.025 mm. Wafers from 2-8 in., die sizes from 0.5 ? 0.5 mm to 15 ? 15 mm, and all EIA tape widths can be handled. Ismeca USA, Carlsbad, CA; ph 760/931-1153, fax 760/931-8713, e-mail [email protected]