Flip chip/chip scale package aligner bonder

06/01/1997

Flip chip/chip scale package aligner bonder

Model CB-5 is a granite-based semiautomatic machine designed to perform high-accuracy and high-force FC and CSP placement and/or bonding in support of prototype and pre-production operations. The system is designed to handle chips of up to 1 in. and can place die from a variety of carriers onto substrates of up to 16 ? 16 in. An optical probe makes possible precise alignment and bonding within ? 5 ?m. Bonding, temperature profile, and timing parameters used for attachment are fully programmable. The machine uses an innovative planarization system that works off both reflective and nonreflective surfaces. Research Devices Inc., Piscataway, NJ; ph 908/572-4800, fax 908/572-4808.