Manual flip chip placer

06/01/1997

Manual flip chip placer

Model 850 flip chip placement system, for low-volume production applications requiring placement accuracies of ?12 ?m, uses a cube beam splitter equipped with two independent intensity controlled fiber optic illuminators for presenting the flip chip and substrate simultaneously, for ease of alignment. The x-y precision slide table provides 12 ? 6 in. of travel in micro-adjustable increments. The large top surface on the x-y slide table features mounting hole patterns to accommodate various types of production tooling. Push-button-activated z motion initiates home, search, and down functions. The substrate holder includes a micrometer-adjusted x, y, and q stage (with 0.5 in. of x-y travel), a 4-in.2 flat vacuum chuck, and stage leveling. Semiconductor Equipment Corp., Moorpark, CA; ph 805/529-2293, fax 805/529-2193.