Wet resist, Polymer removal research set under semitool Imec Development deal

06/01/1997

Wet resist, polymer removal research set under

Semitool-IMEC development deal

Under a joint research project, process equipment supplier Semitool, Kalispell, MT, and a European microelectronics research center will develop next generation wet resist and polymer removal techniques for use in front-end and back-end processing.

According to Ian Sharp, product manager of Semitool`s European unit, the company`s wet process platform, known as the Magnum, will be installed at the Belgium-based IMEC Microelectronics Research Center late this summer, with complete strip development work beginning in early autumn.

"The key challenges [of this project] will be to improve the quality/cost of removal with ever-demanding process requirements," Sharp said. "This will focus on chemical consumption reduction, new processing techniques, and new chemistries, while improving process performance in key areas, such as oxide etch reduction, metal corrosion elimination, and improved contact resistance."

The initial contract between IMEC and Semitool, which is currently building a 38,000-ft2 production facility in Cambridge, UK, will run for two years. In addition, the contract can be extended for one-year periods.

Sharp said IMEC`s long-term relationships and experience with other major chip companies gives Semitool the opportunity to demonstrate the capabilities of its equipment. "[IMEC`s] expertise in process integration will be of enormous benefit in the further evaluation of the Magnum System," he said. - Christine Lunday, Wafer News