Mor R&QA

05/01/1997

More R&QA

I am a reliability engineer and have been a reader of Solid State Technology since graduate school. I am continuously impressed with the depth of the articles and the breadth of issues covered, as well as the overall quality of the publication. As semiconductor technology progresses to 0.25-mm design rules and beyond, we are observing changes in the physics of device operation that may have profound impact on future device reliability and our ability to measure and quantify it.

I would very much like to see articles addressing these types of issues, and what types of advances companies such as HP, which makes equipment for evaluating device reliability, may be making in their reliability evaluation solutions and equipment offerings. I would also like to see more articles on device reliability and quality in general. Thank you for considering my opinion, and for your continously successful efforts to produce an interesting and informative publication.

David George

R&QA Dept., NEC Corp.

Kawasaki, Japan

Thank you for a very useful suggestion. As more fabs ramp-up to 0.25-?m production, we will certainly address the new reliability and manufacturability issues that arise.

Katherine Derbyshire

Chief Technical Editor