Literature update

05/01/1997

Electronic interconnection publications and training materials catalog

This 37-page, full-color catalog describes publications, training videos, and CD-ROMs on IC interconnection and packaging. The catalog includes sections on artwork and test boards; design publications; printed wiring board publications; manuals; training videos and CD-ROMs; proceedings; and environmental health and safety. A calendar of events and information on the Assembly Marketing Research Council are also included. The Institute for Interconnecting and Packaging Electronic Circuits (IPC), Northbrook, IL; ph 847/509-9700, fax 847/509-9798, URL http://www.ipc.org.

Endpoint controller/temperature measurement brochure

This full-color brochure describes endpoint controllers and temperature measurement equipment for wafer fabrication. Endpoint controllers work noninvasively to detect when the chemical mechanical planarization (CMP) process is complete. They can monitor up to five polishing heads simultaneously, and can be retrofitted to existing CMP tools. For plasma-etch process endpoint detection, optical emission spectroscopy controllers track chemical gases in the etch chamber and correct for background noise. Noncontact optical fiber thermometers with sapphire crystal sensors measure wafer temperatures in rapid thermal processing, CVD, PVD, and oxide-etch processes. Luxtron Corp., Santa Clara, CA; ph US 800/627-1666 or ROW 408/727-1600, fax 408/727-1677.

Bumping service design diskette

This guide for IC packagers provides information on designing flip chip ICs that will be bumped using the Flex-On-Cap process. Included on the diskette and website are sections on wafer requirements and minimum pitch capabilities; flip chip design standards like under-bump metallurgy, available solder alloys, a number of IC design considerations, and mask data requirements; and development directions like fine pitch, redistributions, interconnect capability, and 200-mm wafer capability. Information on test die is also included. The guide is available in diskette form, or it can be downloaded from the company`s web site. Flip Chip Technologies, Phoenix, AZ; ph 602/431-6020; e-mail [email protected], URL http://www.flipchip.com.

Vacuum catalog on CD-ROM

This interactive, audio-visual catalog in English and German describes over 3000 vacuum products, accessories, and components. A glossary of technical terms and technical data that can assist the user in determining specific requirements for vacuum products and performance are included. Information on application areas, characteristic curve, scale drawing, accessories, and options can be accessed and printed. The catalog also enables the user to find current prices, to input an order, or to make inquiries regarding product selection. Pfeiffer Vacuum Technology Inc., Hudson, NH; ph 603/595-3243, fax 603/595-3250.

Ovens and furnaces catalog

This full color, 80-page catalog details over 350 unit styles of ovens and furnaces, including lab, bench, cabinet, universal, truck, cleanroom, walk-in, and conveyor ovens, and bench, tool room, lab, box, car bottom, and tube furnaces. Information on specs and custom design and manufacturing services is also provided. There are also sections on control and instrumentation, Class A oven equipment for solvent processing, modified equipment and options, and oven construction details. The Grieve Corp., Round Lake, IL; ph 847/546-8225, fax 847/546-9210, e-mail [email protected].