In-line contamination control

05/01/1997

In-line contamination control

Total-reflection X-ray fluorescence spectrometry provides quantitative elemental information about contaminants on semiconductor wafers, and the TREX 620 system uses this technique to monitor surface and near-surface metallic contamination. The system`s x-ray optics achieve detection limits in the low 109 atoms/cm2 range. Equipped with sealed x-ray tubes, the tool requires little maintenance; mean time between service is >5000 hours, and mean time between failures is >2000 hours. Footprint is 1.6 m2, and a built-in x-ray generator and personal computer suit the tool well for in-line fab use. The optional SECS II communication protocol facilitates integration within the production line. Particle contamination is kept to a minimum by vacuum robotic handling of 6- and 8-in. wafers. Minienvironment and SMIF interfaces are also available. Philips Analytical X-Ray, Almelo, The Netherlands; ph 31/546-839-430, fax 31/546-839-598, URL http://www.philips.com/axr.