Die loader/inverter

05/01/1997

Die loader/inverter

The MRSI-906 high-speed die loader inverter is designed to remove bumped flip chips directly from diced wafers and present them (flipped) bumps-down to the MRSI-505 Ultra-Precision Assembly Work Cell. The system uses upward-looking optics to provide high-speed vision processing of bumps or features. The design of the 906 allows for parallel processing of flip chip die, to increase overall system throughput. Additional features include multiple-wafer capability. The system can pick from a variety of wafer sizes, including 200 mm. MRSI, Chelmsford, MA; 508/256-4950, fax 508/256-5120.