Solder-bumped wafer relow furnace

05/01/1997

Solder-bumped wafer reflow furnace

The Falcon 8/C solder-bumped wafer reflow furnace is a bottom-up conduction and top-down convection system designed to handle 4-, 5-, 6-, and 8-in. wafers. It has automated on/off loaders for integration into fully automated production lines. Optional ADE automated wafer handlers are available (one for each end of the reflow machine) that accommodate 25-wafer-capacity Fluoroware cassettes. Special platen and sweeper bar designs help to cradle the wafer and protect the delicate bumps as the wafer moves through each of the heating and cooling zones. Sikama International, Santa Barbara, CA; ph 805/962-1000, fax 805/962-6100.