Epoxy die bonder

05/01/1997

Epoxy die bonder

System 110 epoxy die bonder uses a programmable XY stage for die placement. The built-in 10:1 XY-? manipulator allows die alignment to better than 10 ?m. Multiple die types can be programmed into multiple substrate arrays under computer control. With an optional paste dispenser, the bonding process can be completed in a single process step. Multilevel modules can be built up using the built-in programmable dispense height. Die can be picked from waffle packs or Gel-Paks in sizes ranging from 0.010 to >0.800 in. Royce Instruments Inc., Napa, CA; ph 707/255-9078, fax 707/255-9079.