Dielectric etch system

05/01/1997

Dielectric etch system

The Dielectric Etch eMxP+ Centura is designed for high-volume, high-selectivity, damage-free production etching of 0.25-?m devices. The system provides a single-product solution to a range of 200-mm dielectric etch applications, including high-aspect-ratio contacts, self-aligned contacts, and via and spacer etch. For critical contact and via etching, the system`s high-selectivity chemistry and broad, damage-free operating window allow 5:1 aspect ratio structures. Throughput is typically >50 wafers/hour for a 3-chamber system. The eMxP+ chamber features a standard electrostatic chuck for very low particle counts. The design of the chamber permits an extended time between wet cleans of >6000 wafers for a 2-chamber system, with chamber liners and an advanced cathode design contributing to wet clean recovery time of =4 hours. Applied Materials, Santa Clara, CA; ph 408/727-5555, fax 408/986-8352, URL http://www.AppliedMaterials.com.