Literature Update

04/01/1997

1997 metrology standards guide

This catalog provides information on metrology standards products for the semiconductor industry. Topics covered are certification services, including an explanation of traceability, the calibration certificate, and recertification procedures, and product guidelines for contamination, dimensional, electrical, and film-thickness products. Also included are a section on worldwide sales offices, standards organizations, and the 1997

trade show schedule; a technical highlight article on RMS microroughness; a product family organizational chart to aid in the selection of standards; and a brief description of new products. VLSI Standards Inc., San Jose, CA; ph 408/428-1800, fax 408/428-9555.

Aluminum nitride report

This report is a preliminary investigation into the mechanical properties of aluminum nitride substrates for use in advanced heat-management applications in high-density, high-power semiconductor devices. The report (NISTIR 5903) is based on a cooperative, precompetitive research project between US (NIST and Dow Chemical Co.) and Japanese (National Industrial Research Institute of Nagoya and Toshiba Corp.) organizations that aims to determine the effects of microstructure and grain boundary chemistry on the strength of aluminum nitride substrates and establish appropriate tests for measuring the strength of heat-management materials. NIST, Gaithersburg, MD; contact: Edwin Fuller, ph 301/975-5795, e-mail [email protected].

1997 test and measurement catalog and reference guide

This reference details electronic test and measurement instrumentation. Products include DMMs, electrometers, precision sources, voltmeters, picoammeters, ohmmeters, source-measure units, power supplies, switch systems, semiconductor characterization systems, and a new line of miniaturized measurement modules. The reference also has application examples to help design a test system, selector guides to compare important specs, and complete product specs. New products, including the model 2400 Digital SourceMeter, a high-speed test solution for large-volume component manufacturers, SmartLink, miniaturized devices for laboratory-grade measurements, and a full line of parametric test systems for DC characterization of semiconductor wafers and devices, are profiled. Keithley Instruments Inc., Cleveland, OH: ph 800/552-1115 or 216/248-0400, fax 216/248-6168, e-mail [email protected], URL http://www.keithley.com.

Semi education catalog `97

This 29-page catalog lists 1997 business and technology education courses available to semiconductor and equipment industry professionals. Business courses include fundamentals of product marketing; principles of selling to the semiconductor industry; understanding and using cost of ownership; and how to successfully manage new product introductions. Technology courses include insights into the IC test process; digital IC test engineering; ergonomic design for 200- and 300-mm wafer processing; and process/device technology. Also included in the catalog is a section on educational videos. SEMI, Mountain View, CA; ph 415/940-6901, URL http://www.semi.org.

Mechanical components catalog

This 56-page catalog details a line of positioners, mounts, holders, adapters, and microholes for use with optical tables. Also available is an eight-page supplement that describes optical table components designed to speed and simplify optics design. Kinetic Systems Inc., Boston, MA; ph 617/522-8700, fax 617/522-6323.

Thermal systems brochure

This brochure describes expanded thermal system services supplied by a manufacturer of heaters, sensors, and controllers. The company can now design, manufacture, procure, assemble, install, and warranty an entire thermal system. The brochure details how this expanded focus can help with axial and SMT assembly; PCB test and calibration; machining; welding and brazing; sheet metal fabrication; finishing; agency approvals; plastic molding; metal casting; product testing/compliance system application expertise; purchasing/contracting; and literature and documentation support. The new capability aids consistency throughout every phase of a project, and maximizes synergy between design, manufacturing, assembly, and installation. Watlow Electric Manufacturing Co., St. Louis, MO; ph 314/878-4600, fax 314/878-6814.

Advanced polymer brochure

This brochure highlights a line of thermally and electrically conductive epoxies and silicones, including one-part systems, room temperature cure products, and flexible conductive adhesives. Featured is a chart that describes performance characteristics of the products and provides information such as conductivity, viscosity, pot life, and cure schedule. New items include TRA-DUCT 2919 (a flexible epoxy), TRA-DUCT 2979 (a one-part epoxy), and TRA-DUCT 6901 (a silicone adhesive). A variety of precisely dispensed (tolerances of ?1%) packages ranging from 2-gm and larger BIPAX to premixed and frozen syringes is also available. TRA-CON, Bedford, MA; ph 800/872-2661 or 617/275-6363, fax 617/275-9249.

MRS 1997 publications catalog

This 85-page catalog describes the publications and meetings of the Materials Research Society (MRS), a nonprofit organization that provides interdisciplinary information on the research and development of new materials of technological importance. Highlighted in the catalog are the MRS Symposium series and the MRS Conference Proceedings series; the Frontiers of Materials Science series and the MRS Turnbull Lectureships series, MRS videotapes; the Advanced Engineering Materials Research Profile Directory, an MRS database; and the Journal of Materials Research and the MRS Bulletin. The catalog also includes upcoming MRS Technical Meetings, information on membership, and indexes arranged by series and title. MRS, Pittsburgh, PA; ph 412/367-3012, fax 412/367-4373, e-mail [email protected], URL http://www.mrs.org.

Electronic interconnection publications and training materials catalog

This 37-page, full-color catalog describes publications, training videos, and CD-ROMs on IC interconnection and packaging. The catalog includes sections on artwork and test boards; design publications; printed wiring board publications; manuals; training videos and CD-ROMs; proceedings; and environmental health and safety. A calendar of events and information on the IPC Printed Circuits Expo 97 and the Assembly Marketing Research Council are also included. The Institute for Interconnecting and Packaging Electronic Circuits (IPC), Northbrook, IL; ph 847/509-9700, fax 847/509-9798, URL http://www.ipc.org.

Endpoint controller/temperature measurement brochure

This full-color brochure describes endpoint controllers and temperature measurement equipment for wafer fabrication. Endpoint controllers work noninvasively to detect when the chemical mechanical planarization (CMP) process is complete. They can monitor up to five polishing heads simultaneously, and can be retrofitted to existing CMP tools. For plasma etch process endpoint detection, optical emission spectroscopy controllers track chemical gases in the etch chamber and correct for background noise. Noncontact optical fiber thermometers with sapphire crystal sensors measure wafer temperatures in rapid thermal processing, CVD, PVD, and oxide-etch processes. Luxtron, Santa Clara, CA; ph 408/727-1600, fax 408/727-1677.

1997 test and measurement catalog

This catalog describes a line of semiconductor test systems and measurement instruments. Digital, mixed-signal, RF, memory/logic, DC parametric test systems, and IC-CAP circuit/device modeling software are highlighted. Semiconductor measurement instruments detailed include semiconductor parameter analyzers, modular DC source/monitor and interactive characterization software, a low leakage switch, a pA meter/DC voltage source, and a 1 MHz C meter. Hewlett-Packard Co., Santa Clara, CA; ph 800/452-4844, fax 800/800-5281, URL http://www.hp.com/go/tmc97.

Vacuum catalog on CD-ROM

This interactive, audio-visual catalog in English and German describes over 3000 vacuum products, accessories, and components. A glossary of technical terms, and technical data that can assist the user in determining specific requirements for vacuum products and performance are included. Information on application areas, characteristic curve, scale drawing, accessories, and options can be accessed and printed. The catalog also enables the user to find current prices, to input an order, or to make inquiries regarding product selection. Pfeiffer Vacuum Technology Inc., Hudson, NH; ph 603/595-3243, fax 603/595-3250.

Electronic component catalog system

This CD-ROM catalog contains software, product, and technical information on a line of electronic components. Described are MLC and tantalum capacitors, resistor chips, arrays and networks, integrated passive components, thin-film inductors, SMT fuses, transient suppressors, filters, piezos, and timing devices. The catalog also includes SpiCap software that helps access circuit modeling information for MLC chip capacitors; a CALCI program that aids in choosing ceramic capacitors for power supply applications; and recent technical papers and seminar data. AVX Corp., Myrtle Beach, SC; ph 803/946-0414, fax 803/626-5186, URL avxsccoast.net.

Bumping service design diskette

This guide for IC packagers provides information on designing flip chip ICs that will be bumped using the Flex-On-Cap process. Included on the diskette and website are sections on wafer requirements and minimum pitch capabilities; flip chip design standards like under-bump metallurgy, available solder alloys, a number of IC design considerations, and mask data requirements; and development directions like fine pitch, redistributions, interconnect capability, and 200-mm wafer capability. Information on test die is also included. The guide is available in diskette form, or it can be downloaded from the company`s web site. Flip Chip Technologies, Phoenix, AZ; ph 602/431-6020; e-mail [email protected], URL http://www.flipchip.com.

High-purity water analysis video

This video contains excerpts from industry experts on the latest tools, techniques, and instrumentation for high-purity water analyses. Specifically, it illustrates the use of ion chromatography (IC) technology for monitoring trace-level ionic contaminants throughout the semiconductor manufacturing process. Among the topics discussed are how IC can identify ions at ppt concentrations in process materials and finished products; track ionic contaminants to their source; maximize high-purity water systems for optimal performance; eliminate catastrophic contamination problems; and improve device yields and reliability. The video is available in NTSC, PAL, and SECAM formats. Dionex Corp., Sunnyvale, CA; ph 408/737-0700.

Ovens and furnaces catalog

This full color, 80-page catalog details over 350 unit styles of ovens and furnaces, including lab, bench, cabinet, universal, truck, cleanroom, walk-in, and conveyor ovens, and bench, tool room, lab, box, car bottom, and tube furnaces. Information on specs and custom design and manufacturing services is also provided. There are also sections on control and instrumentation, Class A oven equipment for solvent processing, modified equipment and options, and oven construction details. The Grieve Corp., Round Lake, IL; ph 847/546-8225, fax 847/546-9210, e-mail [email protected].

Electronics packaging material brochure

This brochure introduces SCAN silica-coated aluminum nitride (Element #406), a filler used in semiconductor transfer molding compounds. SCAN filler has several advantages over thermal management methods like fused silica and heat spreaders or slugs; it is 5-7? more thermally conductive than standard molding compounds, can be used for a range of packaging applications, lowers packaging costs, and improves reliability. The Dow Chemical Co., Midland, MI; ph 800/441-4369.

Thin-film coating brochure

A six-page, full-color brochure highlights a line of standard and custom thin-film coatings that cover the wavelength range from ultraviolet to near infrared. Graphs and technical specs are provided for high reflector coatings; neutral density filters; mirror coatings; MGF2 and "V" coatings; standard broadband coatings; and beamsplitter coatings. Ion beam sputtering, ion assisted electron beam deposition, electron beam deposition, and resistance source deposition techniques are also available. Guernsey Coating Laboratories Inc., Ventura, CA; ph 805/642-1508, fax 805/642-1554, e-mail [email protected] or URL http://www.gclinc.com.