Vision system for wire bonders

04/01/1997

Vision system for wire bonders

An improved Cognex vision system has been added to the 2460-V and 2470-V automatic wire bonders. The system processes 64 gray-level patterns with sub-pixel calculation and fast repeatable capture of low-contrast reference fiducials, pin-outs, gold-on-glass patterns, and other substrate metallizations. A look-down camera with autofocus lens and zoom optics allows clear, sharp imaging of a wide range of devices at various bonding levels. Both systems feature precise loop control and wire length control. High-frequency impedance matching and long low loops control package inductances, provide reduction of rework and test iterations, and allow assembly of thin-profile packages. Dual-mode ultrasonics provide more than 100 discrete programmable power levels for adjustment to variations in bonding sur-faces, packages, and parts. Palomar Products Inc., Carlsbad, CA; ph 619/931-3622, fax 619/931-5191.