Automatic smart card die bonder

04/01/1997

Automatic smart card die bonder

Die Bonder SMART is an automatic, continuous tape die bonder for smart card assembly that provides up to 4000-units/hr throughput, using 35-mm dual-position tape. It combines a fully automatic die bonder with a reel-to-reel tape-handling system and can index 35-mm, fixed-width tape reels that are up to 500 mm dia. Tape indexing and transport capabilities include automatic interleaf wind-up and reject hole detection anywhere in the active circuit area. Tape travels directly from the die bonder into a cure oven, where the epoxy is fully cured and exits ready for wire bonding. The wafer-handling system accommodates 100- to 200-mm wafers and 1- to 7.62-mm die sizes. Die Bonder SMART also features a pattern recognition system for wafer alignment and defect detection. X/Y die placement accuracy is ?2 mils at 3s; q accuracy is ?1? with the standard nonrotary bondhead. Kulicke & Soffa Industries Inc., Willow Grove, PA; ph 215/784-6000, fax 215/659-7588, URL http://www.kns.com