Wafer inspection system

03/01/1997

Wafer inspection system

ES-220 Series automated systems, for cost-effective inspection of wafers and masks, can be configured to handle 300-mm wafers. Applications include inspection of patterned wafers before and after dicing, as well as chips in gel- or waffle-paks. As a metrology tool, the ES-220 can be used for precision measurement of critical dimensions or overlay registration. Adaptive inspection and precision metrology achieve >95% probability of defect detection, with <1% false defect rate, both at the highest magnification. Inspection time ranges from 1-30 sec/chip, depending on defect resolution requirements and chip size. Eutecnics Inc., Acton, MA; ph 508/263-9998, fax 508/263-9942, e-mail [email protected].