Wafer marking system

03/01/1997

Wafer marking system

The WaferMark DSC300 system, which is equipped with an Nd:YAG laser, is designed for hard marking of 300-mm wafers (as well as 150- and 200-mm). It has a throughput of 200 wafers/hour. Features include two load/unload wafer cassette stations capable of performing no-work-over-work handling. Wafer transport from the cassettes to the optical alignment/marking station is accomplished via a pick-and-place robotic arm with dual vacuum wand. Marking fonts may include SEMI OCR and BC 412, as well as 2-dimensional symbology; marking modes available are dot matrix HardMark, and optional SoftMark and MultiSoftMark. Lumonics/Oxnard Operations, Oxnard, CA; ph 805/485-5559, fax 805/485-3310.