Trace metal monitoring

03/01/1997

Trace metal monitoring

MicroSample X-Ray Florescence (MSXRF), for monitoring of process equipment, extends the range of XRF to the parts-per-billion sensitivity level, allowing monitoring of trace element contamination in chemical baths or monitoring of process-induced metallic contaminants in such equipment as implanters, plasma etchers, furnaces, RTA, TEOS, CVD, and other high-energy deposition or etch systems. Because MSXRF`s preparation techniques eliminate the complexities associated with ICP-MS and GFAAS, this new metrology tool gives engineers the ability to monitor and improve fabrication processes almost in real time. Process Analytics, Orem, UT; ph 801/221-1508, fax 801/221-1121.