USA

03/01/1997

USA

Planergy Inc., Austin, TX, an independent energy service company, will undertake a pilot study on energy usage patterns in semiconductor fabrication facilities. The study, which is the first phase of SEMATECH`s energy conservation program, will survey and analyze energy use at two US manufacturing sites. This study and subsequent worldwide surveys will encompass all aspects of the silicon-based semiconductor manufacturing process from raw wafer through completed chip.

Nanometrics Inc., Sunnyvale, CA, has been selected to supply an advanced design metrology tool to the International 300mm Initiative (I300I). The tool, known as the NanoSpec 8300XSE, is intended for the precise measurement and analysis of thin films deposited on 300-mm wafers by various film deposition systems being studied by the I300I.

The Pinson Institute, Campbell, CA, is a new company started by Jay Pinson, former dean of engineering at San Jose State University and director of education at SEMI. The company will offer contract services in education and training to the semiconductor industry and other high-tech sectors. Courses in technology, business, and management will be offered at its own site and at company sites; consulting services will also be available. Short courses are offered in many areas of semiconductor processing, device physics, metrology, materials, and a number of other manufacturing-related areas.

Tylan General has agreed to be acquired by Millipore Corp., Bedford, MA, for $16/share, or about $133 million. The deal would allow Millipore to combine its smart gas purifiers with Tylan`s intelligent gas panels to provide an integrated product. The deal will be financed with bank borrowings. Millipore expects the transaction to be accretive to earnings by the second half of 1997.

The Semiconductor Electronics Division of the National Institute of Standards and Technology (NIST) and the Semiconductor Research Corp. (SRC) have established a new $75,000 fellowship at Stanford University that will support a graduate engineering student and fund research aimed at improving the performance of integrated circuits.

Sharp Corp., Sunnyvale, CA, a maker of LSI technologies, and SanDisk Corp., a supplier of data storage products, have signed a cross-licensing agreement for flash memory-related patents. Under the agreement, the companies have licensed each other`s patents covering design and manufacture of flash memory products, giving both companies worldwide rights to use the patents.

American Silicon Products Inc. (ASP), a wholly owned subsidiary of Semiconductor Packaging Materials Co. Inc., will acquire and continue the business of Silicon Materials Service (SMS), Garland, TX. ASP will acquire 100% of the outstanding stock of Silicon Materials Service B.V., Helmond, Netherlands, from Air Products and Chemicals Inc. Analyst Dan Rose of Rose Associates said the deal could create the number-two wafer reclaim firm in the world, with total revenues of about $31 million, behind Mimasu`s $50 million.

Integrated Solutions Inc. (ISI) and Lucent Technologies have signed a contract to develop and sell prototype manufacturing systems to make submicron integrated circuits based on Lucent`s SCALPEL electron-beam technology. The agreement will license SCALPEL technology to ISI, which will develop, market, manufacture, and support systems that will permit semiconductor companies to make ICs with design features at widths =1 ?m..

Advanced Power Technology (APT), Bend, OR, and GAD Semiconductor have signed a joint OEM agreement to produce and market gallium arsenide power diodes. GAD will supply high voltage GaAs diode chips based on its proprietary, patented technology. APT will package, test, qualify, and market GaAs diodes through its worldwide sales and distribution network.

FSI International Inc., Minneapolis, MN, has installed an ARIES CryoKinetic cleaning system in SEMATECH`s Advanced Technology Development Facility in Austin, TX. The installation is part of a process development project whose objective is to evaluate the new CryoKinetic cleaning technology for cleaning efficiency, reliability, and effectiveness for use in 0.25-micron semiconductor manufacturing. In addition, FSI has received a $10 million order to provide chemical management equipment and support to Anam Industrial Co. Ltd. for its new semiconductor device manufacturing facility in Seoul, South Korea.

Advanced Technology Materials Inc., Danbury, CT, is restructuring its strategic partnership agreement with Matheson Gas Products regarding the manufacture and distribution of ATMI`s Safe Delivery Source product line. ATMI will assume responsibility for product manufacture, while Matheson`s Electronic Products Group will toll manufacture for ATMI and have rights to distribute the product to worldwide ion implant users.

Texas Instruments (TI) has entered into an agreement with the Italian government to build a new $1.2 billion wafer fab at Avezzano, where TI already has a DRAM facility. The AFX press agency reported that TI will get 540 billion lire (about $350 million) in federal assistance, and that the plant is expected to come on line in 1999 with 750 new employees.

Electro Scientific Industries Inc., Portland, OR, has delivered multiple unit orders of memory yield improvement systems to Hyundai Electronic Industries and Samsung Electronics Co. Ltd. The $3 million-plus order to Hyundai was for model 9250 and model 9300 systems, which will be installed at Hyundai`s Ichon, South Korea, facility. The $2 million-plus order to Samsung was for model 9250B systems, which will be used in Samsung`s Kiheung facility.

Intel Corp., Folsom, CA, is licensing Tessera Corp.`s micro ball grid array (BGA) chip-scale packaging as part of its packaging portfolio for future flash memory devices. The MicroBGA package measures 1-mm thick and provides significant board space and height savings over other surface mount packaging; up to 80% over a TSOP package on an 8-Mbit flash memory. In addition, Tessera has licensed its micro ball grid array (BGA) IC packaging technology to Texas Instruments (TI). The BGA packages will be targeted for high-density memory devices, including flash memory.

CFM Technologies Inc., West Chester, PA, a manufacturer of wet processing equipment, has received a $16.1 million order from LG International (America) Inc. for six Full Flow FPD tools to be used for precision cleaning and etching of flat panel displays. Installation is due 2Q and 3Q97.

PRI Automation Inc., Billerica, MA, has received a $7.7 million order from Anam Industrial Co. Ltd. for stockers, AeroTrak overhead monorail, TransNet material control software, and PRI`s automated reticle management system. PRI has also received a multimillion dollar order from a domestic semiconductor manufacturer for stockers and AeroTrak overhead monorail. The systems will be used for a full-factory automation system at a fab in the Southwestern US.