USA

02/01/1997

USA

Applied Materials Inc., Santa Clara, CA, has entered the metrology and inspection equipment market by acquiring Opal Inc., a supplier of CD-SEM systems, and Orbot Instruments Ltd., a supplier of wafer and reticle inspection systems based in Yavne, Israel. Applied commenced a cash tender offer for the outstanding shares of Opal`s common stock at $18.50/share net to the seller in cash. Proceeds to the shareholders of Opal were approximately $175 million, while the net cash cost of the transaction to Applied is about $145 million. Orbot was acquired for about $110 million in cash.

Interserv, a large-area lithography specialist based in Bloomington, MN, has shipped a 300-mm lithography system to SEMATECH. The maskless system uses laser interferometry to image fine lines on the wafer surface. No lenses are required, and a 1-m depth of field is possible. The shipped system uses 365-nm exposure to produce 0.18-micron lines. The tool will initially be used for rapid exposure of fine features over large areas.

Plasma and Materials Technologies Inc. (PMT), Chatsworth, CA, has completed its $75 million purchase of UK-based deposition supplier Electrotech. The companies will become separate profit and loss units, each retaining for now its own manufacturing operation. Electrotech is transitioning to the use of a Brooks Automation wafer handling platform, which PMT has used for several years.

Microlithography Chemical Corp. (MCC), Newton, MA, a specialty manufacturer of advanced lithography photoresist products, has reached a collaborative research agreement with SEMATECH to develop a high-speed top surface imaging, positive photoresist system for high resolution, 180-nm lithography. Under the agreement, MCC will provide member companies with evaluation quantities of a phenolic resist capable of sub-0.20-micron resolution utilizing 193-nm optical lithography in a nonchemical amplified top surface imaging process.

VLSI Technology Inc. plans to cease production in its San Jose wafer fabrication plant by the end of 1997, reducing its San Jose workforce by about 300 people. The San Jose plant has been underutilized since the company began shifting to new markets in 1995. VLSI will now focus on providing semiconductor devices for the new markets of cable and satellite set-top boxes, wireless communications such as cellular phones, networking equipment, computing, and secure products. The decision to shut down the San Jose fab followed the company`s attempt to market the plant as a foundry, and search for potential buyers or investors.

Eaton Semiconductor Equipment Operations (SEO), Beverly, MA, has formed the Eaton Flat Panel Equipment (FPE) group dedicated to the development, manufacture, and marketing of flat panel equipment. The group, which will enter the $9.2 billion flat panel manufacturing industry, will build on SEO`s core technology of ion implanters for the semiconductor industry to design and develop ion implanters specifically for use in the manufacturing of FPDs.

Mattson Technology Inc., Fremont, CA, has delivered a 300-mm strip processing tool to the International 300mm Initiative (I300I). Based on Mattson`s Aspen platform, and using an inductively coupled plasma source, the chamber can process two wafers simultaneously, stripping between 60 and 120 wafers/hr depending on resist thickness.

Hyundai Semiconductor America Inc. has placed an order with Applied Materials Inc. worth $117 million for semiconductor manufacturing equipment to be used in Hyundai`s new Eugene, OR, facility. The order includes systems for both phase one and phase two of Hyundai`s fab, which will manufacture 64- and 256-Mbit DRAM devices. The new fab is Hyundai`s first to be built in the US. Part of the order was booked in Applied Materials` fiscal 4Q96, with delivery scheduled in the first half of the company`s FY97. The remainder has been booked in the company`s fiscal 1Q97, with delivery slated for early in FY98.

Asyst Technologies Inc.`s subsidiary Asyst Software Inc. (ASI) has signed a joint marketing agreement with FASTech Integration Inc., Lincoln, MA, a supplier of factory automation software tools for the semiconductor manufacturing industry. Under the agreement, ASI can now offer FASTech`s software products as part of the company`s fab automation solutions to new or existing customers around the world.

Balzers Process Systems, Hudson, NH, has acquired a 51.4% interest in Axtral, a Grenoble, France, holding company for two French firms that produce etch, deposition, and RTP systems for semiconductor fabrication and micromachining. Balzers has served as a US rep for the companies, Nextral and Addax, since 1995. Nextral`s Reactive ion etch and microwave etch systems (which account for 40% of the firm`s business) are used for depassivation in failure and construction analysis of wafers and packaged chips, while Addax specializes in RTP. Pacific Scientific`s High Yield Technology (HYT) Division, a supplier of in situ particle monitor (INPM) tools, will combine the submicron liquid particle monitoring line of its Hiac/Royco sister division with the HYT vacuum particle monitoring products to provide integrated solutions for semiconductor manufacturers. In addition, HYT has entered into an agreement with Bruce Technologies International, a supplier of horizontal and vertical furnaces, to offer HYT ISPM products as an integrated option in Bruce`s Apogee vertical LPCVD furnaces.

SpeedFam International Inc., Chandler, AZ, has booked a $6.35 million order from Promos Technology Inc. for the Auriga next-generation CMP-V system for planarization of advanced semiconductor devices. Promos, a joint venture of Siemens Semiconductor Group and Mosel Vitelic, manufactures 16- and 64-Mbit DRAMs. Shipment of the first Auriga system to Promos is scheduled for December.

KLA Instruments Corp., San Jose, CA, a provider of defect detection and alignment algorithms, will provide an Off-line ADC version of its IMPACT Automatic Defect Classification (ADC) System. Meanwhile, KLA and Leica Mikroskopie und Systeme GmbH, a player in optics technology, have formed a multiyear OEM agreement for Leica to supply new high-performance review stations for the KLA product. Off-line Station beta system deliveries are targeted for mid-1997.

PRI Automation Inc., Billerica, MA, has received a $4.5 million order from Mitsubishi Silicon America Corp. (formerly Siltec Corp.) for an automated materials handling system (AMHS) for Mitsubishi`s Mod V fab in Salem, OR. The AMHS will include stockers, an AeroTrak overhead monorail system, machine loading robot vehicles, and loading robots for both interbay and intrabay transport and storage of 150- and 200-mm silicon wafers. PRI expects to install the system in early 1997.

Ultratech Stepper Inc., San Jose, CA, a supplier of photolithography systems, has shipped its model 2244i stepper to a major new US customer that is implementing an Ultratech/ASM Lithography (ASML), Veldhoven, The Netherlands, mix-and-match solution to manufacture advanced microprocessors. Launched last year, an alliance between the two companies was formed to help chipmakers reduce manufacturing costs and boost productivity in their advanced lithography operations.

Lam Research Corp., Fremont, CA, has made an agreement with Texas Instruments to license TI`s ControlWorks software package for developing Lam`s next generation 300-mm etch and CVD equipment control system. The license enables Lam to accelerate its development cycle for advanced control capabilities. The software framework for ControlWorks was developed by TI for the Microelectronics Manufacturing Science and Technology Program.

Photon Dynamics Inc., San Jose, CA, has improved the test coverage for its FIS flat panel inspection systems to make it easier for flat panel display manufacturers to produce higher quality displays and reduce production costs associated with defective panels. The improved test coverage is the result of six new quality related tests for the FIS systems: pixel defect detection for SXGA and XGA resolution panels, flicker, image retention, gray scale gradient, display pattern position, and crosstalk.

Intel`s Fab 16 is a new logic fab that will be built in Fort Worth, TX. Operations are slated to begin in 1999. Cost for the 800,000 ft2 facility is estimated at $1.3 billion, will incorporate a 75,000 ft2 Class 1 cleanroom, and will be designed to accommodate 300-mm tooling. Initial design rules will be 0.25 micron, with migration to 0.18 and possibly beyond envisioned; deep UV lithography will be used extensively.

Cognex Corp., Natick, MA, a supplier of machine vision systems, has received a purchase order for $1.9 million from Therma-Wave Inc., Fremont, CA, a maker of film measurement and implant monitoring systems. Cognex has also entered into an OEM agreement with Hantech Co. Ltd., Seoul, Korea, a maker of wafer handling and sorting equipment. Under the agreement, Hantech expects to purchase more than $1 million of Cognex`s acuReader/OCR optical character recognition systems and acuLight wafer illumination modules over the next two years.

Electronic Visions Inc. (EV), Phoenix, AZ, a manufacturer of microelectromechanical systems processing equipment, has received a multimillion dollar order from Input/Output Inc., Stafford, TX, a maker of seismic systems. In addition, EV has installed an EV-850 silicon-on-insulator 200-mm wafer bonding machine at Hyundai Electronics Industries Co. Ltd. in Kyoungki-do, Korea. Hyundai will use the device to make 1-Gbit DRAMs.

Fusion Systems Corp., Rockville, MD, has received orders worth over $7.5 million from three DRAM manufacturers in the US and Asia. The orders were for the new Gemini ES (enhanced strip), Gemini ozone asher, Gemini photostabilizer tools, and Gemini downstream plasma asher. The products are scheduled to be shipped in 1Q97 and 2Q97.

Williams Advanced Materials Inc., Buffalo, NY, a supplier of materials to the semiconductor, hybrid microelectronics, and data storage industries, has opened a sales service center in the Philippines. The company already has an office in Singapore, Malaysia, and the UK.