HDP-CVD system

02/01/1997

HDP-CVD system

The Ultima HDP-CVD Centura system has a common chamber to deposit not only standard HDP-CVD oxide film (undoped silicate glass) but also low-k fluorinated silicate glass. Ultima`s in-situ cleaning process uses a technology in which plasma generation takes place in a remote location using micro-waves as the power source. Ions and reactive neutrals are created in the plasma chamber (applicator); as the gases exit the applicator, only the reactive neutrals (free fluorine) are carried downstream to contact the chamber surfaces. Since no fluorine plasma is present in the process chamber during clean, the purely chemical etch cleaning process selectively removes only the deposited oxide by-products. No internal chamber components are eroded, resulting in low contamination levels and low operating costs. Applied Materials Inc., Santa Clara, CA; ph 408/727-5555, fax 408/986-8352, URL http://www.AppliedMaterials.com.