Die attach system

01/01/1997

Die attach system

The SL9002-Lite die attach system, for SO, PDIP, PLCC, and other leadframe applications, features volumetric dispense technology for accurate bondline thickness and fillet; an x, y, z-motorized dispense unit for automatic changeover; a synchronized die eject system that causes no die stress or damage; a closed-loop servo system for accuracy and repeatability; an 8-in. wafer loader with no expansion, which makes possible multiple wafer reload; and a DC-motor-controlled x, y, z bond head for programmable die position and multichip placement for matrix leadframes. Alphasem AG, Berg, Switzerland; ph 41/71637-6363, fax 41/71637-6364.