300-mm wafer analysis

01/01/1997

300-mm wafer analysis

This FTIR accessory is designed for analysis of 300-mm wafers. MAP300 is fully automated and suitable for determination of epitaxial layer thickness in the reflectance mode, and boron, phosphorous, silicon, germanium (BPSG), carbon, and oxygen measurements in the transmission mode. It mounts in the sample compartment of the FTIR spectrometer, and with optional adapters it accommodates all other wafer sizes. Individual wafers are rotated and/or translated by stepper motors in a sequence pre-programmed by the system operator. The module is controlled by AutoPRO software, which provides a simple user interface for multiple point wafer analysis (mapping) and DDE links for easy integration with other software packages. PIKE Technologies Inc., Madison, WI; ph 608/274-2721, fax 608/274-0103.