Low-pressure spin processor

01/01/1997

Low-pressure spin processor

This spin processor, for partial vacuum applications, is available in natural polypropylene or PTFE Teflon with either an 8.5- or 12.5-in. I.D. process chamber. Applications include vacuum drying, CO2 cleaning, fusion bonding, in-situ coat and removal of dissolved gases from deposited films, and dispensing of chemicals without a pressure vessel or pump. Laurell Technologies Corp., North Wales, PA; ph 215/699-7278, fax 215/699-4311, e-mail [email protected].