Sputtering targets

01/01/1997

Sputtering targets

This fine micro-structure titanium-tungsten target has very low oxygen content, resulting in minimal device-defect generation and a high deposition rate. It is processed in a vacuum similar to the environment in the sputtering chamber, eliminating trapped gases such as oxygen and nitrogen. A copper target is also available that achieves low resistivity and good electromigration resistance and is compatible with a variety of leading-edge sputtering tools. Johnson Matthey Electronics, Spokane, WA; ph 509/924-2200.