Wafer surface characterization

01/01/1997

Wafer surface characterization

The HRP-200 high-resolution profiler is designed to perform automated, in-process planarization monitoring of wafers with device geometries as small as 0.25 ?m. The instrument has the ability to measure a surface on both the macroscopic (50 mm) and microscopic (0.25 ?m) scales. Its fine-resolution capabilities allow device manufacturers to optimize the CMP process by measuring such characteristics as tungsten plug recess, pattern-induced erosion, dishing of metal features, and scratching of interlayer dielectric films. Dual Stage Imaging technology uses both sensor and sample imaging stages, giving the system its macro-to-micro imaging ability, and improved lateral scanning resolution to 1 nm enables the system to capture more surface detail between scans - an essential feature for submicron surface analysis. The UltraLight sensor allows the HRP-200 to scan wafers using a constant force as small as 0.05 mg with no damage to the wafer surface. Tencor Instruments, Mountain View, CA; ph 415/969-6767, fax 415/968-9482.