Product Roundup
10/01/2000
IMAPS Product Highlights
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Each fall, the International Microelectronics and Packaging Society (IMAPS) hosts a symposium and exhibition that attracts more than 6,000 scientists and engineers in microelectronics and packaging. This year's 33rd annual event was held from September 18 to 22 at the Hynes Convention Center in Boston, Massachusetts. The show featured more than 300 exhibiting companies, and technical sessions on topics such as flip chip, RF microwave and wireless, CSP, polymeric materials for packaging, thermal management, and many more. The following is a sampling of products from companies that exhibited at IMAPS 2000. Take a few minutes to review the products of interest and circle the corresponding numbers on the reader service card to receive more information. For faster results, fax the card to 413-637-4343.
Automated Fluid Dispenser
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Asymtek has released the Millennium M-620 system, part of its M-600 Series dispensing platforms, to specifically target the demands of semiconductor assembly companies. Its standard features include a DP-300 linear pump for repeatable dispensing regardless of fluid viscosity. Patented Mass Flow Calibration technology maintains a closed-loop dispensing process for continuously accurate dispensing. Dual-mode contact and impingement heating with four-channel control offers consistent substrate heating, and automatic pattern recognition helps ensure precise fluid placement and correct orientation of the part to be dispensed. The M-620 system also contains an IPC-SMEMA compatible conveyor and the capability to network the system via the Ethernet interface network card. Asymtek, Carlsbad, Calif.
Current-sensing Resistors
Heraeus Inc. introduces the R400A Series resistor system for automotive and other applications requiring low-ohmic current-sensing resistors. It features resistance values as low as 90 milliohms/square (±10 percent), with temperature coefficients of resistance at less than 100 PPM, making them stable across a wide range of temperatures. R400A Series materials may be used to manufacture low-ohmic chip resistors, or may be printed directly onto the ceramic substrate in conjunction with other thick film materials. It exibits good print resolution for use in typical serpentine layouts, is laser trimmable and has good power handling. Heraeus Inc., West Conshohocken, Pa.
Silicone Encapsulant
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Slygard 275 primerless encapsulant is a two-part, flowable silicone liquid that cures rapidly at room temperature to a flexible, durable elastomer. The solventless material exhibits no outgassing and releases no harmful by-products as a result of the curing process. Designed for auto-dispensing and high-speed production, the new material's viscosity of 2,700 cps makes it ideal for penetrating into complex component shapes. It cures at a predictable and consistent rate, and at room temperature, the material will form a tack-free surface within 20 minutes. Dow Corning Corporation, Midland, Mich.
Curing System
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Lambda Technologies has added the MicroCure CF5100 continuous flow model to its line of Variable Frequency Microwave (VFM) curing systems. It is reported to be capable of processing a continuous flow of parts, without the need for closing doors or separating into batches. It features a unique system of microwave chokes that completely contains microwaves within the curing area, allowing it to remain open to a conveyorized flow of parts. Lambda Technologies, Morrisville, N.C.
Laser Diodes and Flip Chip Bonders
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The multi-use Model 860 Omni bonder can be configured to bond laser diodes, flip chips or eutectic bonded die. The joystick-controlled semiautomatic system aligns and attaches die sizes from 0.006-in. square to 1-in. square at a throughput rate of 120 placements per hour with placement accuracy of ± 5 µm. The system's new optional flip chip rework attachment removes chips that have been bonded with the new reworkable underfill materials. Semiconductor Equipment Corp., Moorpark, Calif.
Ribbon Bonding Interconnects
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Model 2470-V from Palomar Technologies' performs ribbon wire bonding to interconnect microstrip transmission lines, wave guides, and passive and active components that operate in high frequency ranges. The rectangular shaped wire offers consistent loop profiles. The ribbon wire carries larger amounts of current without forcing the interconnect media into a burnout condition. Model 2470-V includes an advanced vision system and feature-rich software for high-performance automatic bonding. Palomar Technologies, Vista, Calif.
Bonding Capillary
Kulicke & Soffa have introduced a new fine-pitch, bottleneck capillary line optimized for 50-micron pad pitch ball bonding applications. It features the industry's tightest +0.05/-0 mil hole and chamfer diameter tolerances. In addition, 0.5 tenth of a mil nominal dimension interval may be specified for a more flexible capillary design and to support a wider range of diameters. The 50-micron capillary is made of a proprietary toughened alumina material, which presents sub-micron average grain size to support the capillary's geometry and increase fracture resistance. Kulicke & Soffa Industries Inc., Willow Grove, Pa.
Lead Attach Machine
Die-Tech's Model 3005 attaches single in-line placement leadframes to substrates as an alternative to hand tooling. It is ideal for small assembly houses and comes complete with a handloader inserter, pressure pad, lead feed, pin removal punch and carrier cut-off punch. The basic tooling will accommodate a wide range of substrate sizes from 0.250 to 4.0 inches long, and from 0.150 to 3.0 inches in depth. A programmable logic controller controls all timing and sequencing. Other options include a choice of leadframe style and pitch, type of inserter and pin removal capacity, as well as power unreeler and multiple package cut-off. Die-Tech Inc., York Haven, Pa.
Composition Analysis Tool
Veeco has introduced the System XR, an X-ray fluorescence deposition thickness and composition analysis tool for microelectronics metal film measurement. The System XR is comprised of four models: the LXR, GXR, MXR and VXR. The LXR utilizes mechanical collimators to provide versatility and application precision optimization for a variety of part requirements. The GXR delivers state-of-the-art performance in mechanically collimated gas proportional detection XRF. The MXR provides 10 times the precision and 10 times the sensitivity of measurement compared to conventional XRF systems. The VXR extends the capabilities of the MXR by incorporating vacuum technology. Veeco Instruments, Ronkonkoma, N.Y.
Microwave Capacitors
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American Technical Ceramics' new 600 Series capacitors offer low ESR - typically 80m½ at 1 GHz. Designed around RF and microwave applications, this NPO capacitor supports requirements where low loss and high performance are paramount. With up to 100 pF in an 0603 case size, the 600 Series has rated voltage of 250 volts. All parts are laser marked and in tape-and-reel. American Technical Ceramics, Huntington Station, N.Y.
Eutectic Die Attach
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The 505 Assembly Work Cell is a flexible system that supports direct gold/silicon eutectic and eutectic reflow using gold/tin and gold/germanium preforms. The system uses programmable closed-loop temperature control. For the process of direct gold silicon eutectic die attach, the 505 first places the die with an inverted pyramid collet and simultaneously scrubs to accomplish eutectic reflow. For gold tin or gold germanium reflow, the 505 places a preform onto the package. The die is then scrubbed to accomplish the eutectic reflow. MRSI, Chelmford, Mass.
Marking Ink
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Emca-Remex is offering a screen-printable white marking ink designed for use on most dark substrates, including epoxy-coated circuitry. Cured films of the epoxy-based P6285M white polymer ink withstand temperature excursions to 250°C and exhibit good resistance to degradation by most solvents. Ideal applications for the white marking ink include telecommunications, automotive and other uses that require high reliability. Emca-Remex, Montgomeryville, Pa.
Robots
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ROIbots are the latest addition to Toshiba Machine's line-up. The slim axes and reduced length design of the ROIbot meet the requirements of limited space applications. The controller is easily programmable through the use of a ROIbot teach pendant or computer and is comparable to the size of a stand-alone AC servo driver. Up to four controllers can be linked together in a multitasking system. The controllers can accept a pulse train input for movement commands. Toshiba Machine, Elk Grove Village, Ill.
Flip-chip Bonder
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Fancort Industries has introduced the Batch Bonder, a tooling system that uses adhesives to attach flip chip, CSPs and other similar small devices to packages and substrates. The system can be used with anisotropic, conductive adhesives or with non-conductive adhesives. It applies heat and pressure on the pick-and-place equipment to complete the attachment. This enables multiple devices to be simultaneously bonded through the application of heat and pressure. Fancort Industries, West Caldwell, N.J.
Manufacturing Services
UltraSource Inc. is a custom manufacturer of thin film circuit devices. The company stocks a large variety of sputtered substrates, so prototypes normally can be delivered in one to three weeks. Custom metallizations, plated through-hole designs, thermal via products and most production orders are supplied in three to six weeks, depending on complexity. UltraSource Inc., Hollis, N.H.
Drilling Products
The 5300 product family is a new line of laser drills for the advanced packaging and high-density interconnect markets from Electro Scientific Industries. These systems create precise micro-vias, enabling users to shrink pad and circuit designs for increased density of the circuit board or package. The 5300 line delivers high accuracy to ±10 microns. The drills are equipped with a compound beam positioner that positions the laser for drilling, increasing throughput by 50 percent over earlier models. This product platform also features a new optical bench that will accommodate future lasers and optical enhancements. The first lasers in the series are the 5310 shaped laser µVia drill for advanced packages and the 5320 copper laser µVia drill for copper-cutting applications. Electro Scientific Industries, Portland, Ore.
Wafer Cleaning
Model 203 removes particles to 0.1 micron from wafer top, bottom and side with a double-brush scrubbing system. Two dedicated brush scrubbing boxes can perform either a two-step clean or clean two wafers simultaneously. A final chamber performs high-performance cleaning with a quartz-enclosed megasonic nozzle, followed by spin drying. It features dual robots for wafer handling. Solid State Equipment Corp., Horsham, Pa.
New Catalog
Remtec offers a new catalog for microelectric packaging solutions to circuit designers. The catalog describes Remtec's proprietary manufacturing process, plated copper on thick film. It also describes the special features of PCTF technology, compatible assembly methods, typical examples of packaging solutions and general design guidelines. Remtec Inc., Norwood, Mass.
Chip Resistors
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HVC Series chip resistors have voltage coefficient of resistance (VCR) ratings less than 1 ppm/v. These resistors are used in high-voltage applications, such as power supplies and instrumentation - anywhere extreme voltage stability is needed. Sizes range from 2512 to 0202 with custom sizes available. OhmCraft, Honeoye Falls, N.Y.