Intarsia advances RF design with seamless simulation
06/01/2000
FREMONT, CALIF. -
As electronic products increase in functionality, the true challenge lies in maintaining outlines that are equivalent to or smaller than their predecessors. While semiconductor technologies have facilitated high levels of integration and more functionality, large numbers of supporting passive devices (R, L and C) remain integral to the overall product design. As a matter of fact, in many portable wireless and computing products, passive components represent approximately 80 percent of the bill of material and 60 percent of the size. For performance reasons, most of these passives cannot be easily integrated onto the semiconductor chip, particularly for radio frequency (RF) circuits where substrate loss or cost of real estate makes such integration impractical.
These challenges are being met head-on by engineers at Intarsia Corporation, a wireless and RF technology integrator serving the cellular, portable computing and networking markets. The PassPort thin film microcircuit design palette allows the designer to quickly produce complex networks integrated into one small microcircuit. The resultant product is not only diminutive in size, but also reduces the number of interconnects, improves reliability and yield, and reduces tolerance variability and parasitics.
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The design palette includes a foundry library, design capabilities, simulation functions and layout tools for custom thin film on glass microcircuits. The palette operates within the framework of the industry-standard Advanced Design System (ADS) from Agilent Technologies. PassPort allows the complete design and manufacture of custom thin film microcircuits in chip-scale or conventional packages. This technology "provides designers the ability to integrate an unprecedented number of both passive and active functions in a single custom solution, improving size and cost performance," said Harry Van Wickle, president and CEO of Intarsia. The use of ADS allows for simulation and optimization of device performance, as well as interaction with other parts of the system. Thus, the pitfalls of trial-and-error optimization by continually swapping out component values during the prototype stage are avoided.
PassPort technology permits large format fabrication using 350 x 400-mm panels. Each panel can produce over 27,000 devices, resulting in significant economies of scale. According to Van Wickle, "The ability to evaluate an entire wireless sub-system within an industry standard simulator permits the system designer to determine the optimum partitioning between thin film circuits and other devices that can be modeled within ADS. Once the electrical design of the thin film circuit is finalized, the designer can quickly lay out and re-simulate the circuit before submission to the foundry."
Products that can be designed with this technology include integrated passive devices (IPDs) and single- or multi-function modules, such as voltage-controlled oscillators, low-noise amplifiers or complete radio transceivers. The Alpha version of the PassPort palette is now available to a limited number of customers. The general release is planned for mid-September 2000. For more information, visit www.intarsiacorp.com.
Current-sharing technology offered without charge
PALM BAY, FLA. - Intersil Holding Corp., a supplier of specialized circuits for integrated communications applications, has developed current-sharing technology that could revolutionize the power environment for the next generation of Intel processors. This advanced current-sharing solution will be available free of charge to any voltage regulator module (VRM) manufacturer.
Although high-performance, dual microprocessor-based systems require highly regulated power levels, the next-generation microprocessor system architecture lacks the ability to deliver a balanced current load because each microprocessor uses an independently controlled VRM. Because each VRM works independently, resultant current imbalances can increase component temperature, decrease system reliability and increase downtime.
The Intersil current-sharing circuit solves this problem by configuring multiple VRMs so that they share, approximately equally, the total current demand of the processors. "This is an industry first," said Rick Furtney, vice president of Intersil's power management products. "Up until now, VRMs have been proprietary solutions. The single current-sharing design that Intersil has developed allows VRMs to be interchangeable and gives computer manufacturers greater flexibility in selecting sources without being concerned with the compatibility issues."
The current-sharing technology equalizes the load on the VRMs, resulting in higher reliability because of the reduced peak thermal demands. This also allows multiple VRMs to respond to dynamic demands from either microprocessor, resulting in enhanced performance.
The technology is offered to manufacturers of either packaged modules or discrete on-board solutions as an answer to common design objectives in high-performance PCs, workstations and server motherboards employing Intel's next generation of microprocessors.
ON Semiconductor teams up with University of Michigan
PHOENIX, ARIZ. - ON Semiconductor, a leading supplier of analog, logic and discrete semiconductor components, has presented a grant to advance research in the field of automotive electronics. Research efforts will be headed by Dr. John Shen, assistant professor at University of Michigan-Dearborn, in the Department of Electrical and Computing Engineering and the Automotive Engineering Interdiscip linary Program.
Automotive electronics make up 17 percent of ON Semiconductor's business, Many of the power products they produce are essential to the construction of ignition coils and engine module boards.
With the research funds, Shen is forming the Automotive Semiconductor Device Research Laboratory (ASDRL) to explore the possibility of uniting semiconductor design engineers with automotive systems engineers in the early stages of an automotive electrical system. One area of focus is the requirements of future 42-V automotive systems.
Shen was chosen because of his extensive background in automotive electronic research, including more than 20 publications, four issued and six pending U.S. patents, and B.S., M.S. and Ph.D. degrees in electrical engineering. Before his academic appointment, Shen was a senior principal staff engineer at Motorola Inc. in Phoenix, Ariz.
According to Shen, "It is the mission of the ASDRL to identify and develop the most cost-effective semiconductor components for specific automotive applications by creating an interactive and cooperative research environment with active participation from both automotive and semiconductor industries."
Tru-Si, LSI Logic set up joint packaging program
SUNNYVALE, CALIF. - Tru-Si Technologies Inc. and LSI Logic Corp. have established a strategic development program to evaluate Tru-Si's
plasma-thinning technology and equipment for use in LSI Logic's chip scale, flip chip and multi-chip packaging. Under the terms of the joint program, both companies will utilize engineering and management resources in addressing packaging issues. LSI Logic will
provide materials, assembly, failure analysis, thermal-performance measurement and modeling/simulation services. Tru-Si will offer wafer-thinning services and thinned-wafer testing or measurement characterization.
The packaging development program is expected to explore topics, such as the optimum die thickness for flip-chip packaging, the optimum process flow for implementation of wafer thinning for quantification and qualification of thinned packages, and the transfer of wafer-thinning processes, thinning equipment and packaging processes to LSI Logic's assembly subcontractors.
NEMI recommends tin/silver/copper alloy
HERNDON, VA. - The National Electronics Manufacturing Initiative (NEMI) has recommended standardized lead-free solder alternatives. For reflow applications, NEMI has recommended Sn3.9AG0.6Cu - a tin-rich alloy with 3.9 percent silver and 0.6 percent copper. For wave solder production, the group has recommended Sn0.7Cu, a less-expensive tin/copper alloy, or, as an alternative, Sn3.5Ag. Use of the recommended alloys will raise the melting point by as much as 40°C, which could impact a number of the materials and steps in the assembly process. The Lead-free Assembly Project is working to identify the impact that eliminating lead will have on the manufacturing infrastructure and will work closely with component, board and equipment manufacturers to provide a smooth transition for member companies wishing to implement lead-free solders.
SMT lab at Texas A&M
WILLOW GROVE, PA. - The Surface Mount Technology Laboratory at Texas A&M's Department of Engineering Technology and Industrial Distribution is giving students a chance to practice mounting components with the same flexible production equipment used by modern manufacturers. Quad Systems Corp. donated a reflow oven and sold a stencil printer and an SMT assembly system to the university at a discounted price. Other participating manufacturers include Northrop Grumman, ARQ Electronics, Motorola IESS and Metal Etching Technologies Inc. The laboratory's production line is also comprised of a fine-pitch assembler and a rework station. Students are learning to operate the machines, as well as use the computer programs that control their functions. Faculty and graduate student researchers use the laboratory to test computer programs written to optimize production efficiency and yield.
SAC certifies European subcontractors
MOUNTAIN VIEW, CALIF. - The Semiconductor Assembly Council (SAC) held its biannual meeting in New Orleans, La., May 11 and 12. The meeting included member approval of SAC certification for Amkor Technologies (Philippines) and ASAT (France). Technical mini-sessions on array packaging, flip-chip technologies and leadless lead frame packaging were well-attended. SAC members include over 80 companies, consisting of semiconductor manufacturers, subcontractors and end-users.
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SAC certification requires compliance to QS-9000 and semiconductor-specific requirements focusing on process control and continuous improvement. At present, there are 14 SAC certified subcontractors. The success of SAC's certification program has initiated the expansion of SAC's activities throughout the supply chain to include suppliers of semiconductor materials, such as die attach materials, lead frames and substrates. As part of a material supplier initiative, SAC welcomes two new member companies: Sumitomo and Dexter Electronics.
Representatives from some of the leading companies in the industry facilitated discussions on the following topics during the technical mini-sessions:
- Array packaging: The industry has seen an explosion in both the number of designs, as well as the volume being produced today. What are the trends in package types, materials and costs? What are the major issues and problems with the use of these packages? What are the major production issues that need to be addressed by the industry? This session looked at the advantages of these package types, as well as the disadvantages. Participants also looked to the future and examined the factors that will influence the industry and the changes that will be seen in new package design features, materials, equipment and processes.
- Flip-chip technologies: By bringing together active current providers of flip chip bumping services, packaging experts from the subcontract assembly arena and end-users at the board level, this session engendered a lively debate. The promise of flip-chip "packageless packaging" has yet to deliver in the kinds of volume applications (outside of the original C-4 houses) that have been predicted for over 20 years. As in past mini-sessions, the panel was challenged by a steady stream of relevant questions, such as the following: Is this about to change? Is it in the process of happening now? What factors are at work to enable the promise?
- Leadless lead frame packaging: This mini-session concentrated on the new leadless, lead frame packages. They are commonly known in the industry as MLF, QFN, LPCC or by other similar names (JEDEC Standard 11-534). These packages are based on a copper lead frame with a total package thickness of generally less than 1 mm. They incorporate a flow and construction similar to more mature lead frame packages. The mini-session covered the construction of these packages, as well as assembly and process options. Also, the session reviewed the pros and cons of this package, as well as its strengths and weaknesses, the perceived market, niches for this type of a package, and possible market trends.
- Board-level reliability: This session addressed reliability issues related to a wide variety of packaging technologies connected to substrates. The primary focus was solder-joint reliability of new component packaging technologies attached to printed circuit boards. The new, smaller packages (e.g., (BGAs, CSPs, flip chips) have proven to be more susceptible to solder-joint fatigue failures related to thermal expansion mismatch than larger, more traditional IC packages (e.g., QFPs, PLCCs, BGAs). They have also demonstrated a higher susceptibility to failures relating to vibration or substrate flexing. These issues are critical for product designs that must survive extended periods in high-temperature environments. Further, many of the stated fatigue failures are now being experienced by products in the more-benign consumer electronics market. As part of this session, methods for enhancing solder joint reliability were discussed. Included in the discussion were alternative attachment materials, underfills, advanced substrate technologies and their relationship to improved board-level reliability.
- Packaging delamination/moisture levels: Today's plastic surface-mount BGA type packages require improved assembly processes and material considerations to meet higher temperature and moisture resistance levels without significant delamination. This technology mini-session provided a panel discussion and presentations on some of the major assembly, material and substrate con sid erations, relative to achieving higher levels of moisture resistance without significant delamination.
SAC is a semiconductor industry organization comprised of manufacturers, end users, and assembly and test subcontractors. SAC's current mission is to implement a methodology for certifying quality systems and process control practices of assembly and test subcontractors to standards established by SAC members. SAC also provides a forum for technology exchange, and a process for supplier chain management.
 From left to right: Regis Buttner (ASAT France), Tom Nichols (Alpha Industries) and Salem Belmegueani (ASAT France). |
The next SAC meeting is scheduled for November; more information is available at www.sacouncil.org.
Extended agreement for reticle technology center
Round Rock, Texas - DuPont Photomasks Inc. (DPI) has extended the operating agreement for the DPI Reticle Technology Center LLC (RTC), a joint venture for advanced photomask development and pilot line fabrication of leading-edge photomasks. DPI and the other joint venture members, Micron Technology, AMD and Motorola, have extended the agreement through 2002.
The RTC is an independent limited liability company originally formed in 1997. Housed in a 25,500 square foot standalone building in Round Rock, Texas, the facility features a 6,500 square foot cleanroom and is equipped with state-of-the-art photomask production and analytical equipment. To date, the companies have invested a total of $75 million.
The RTC employs about 70 scientists, engineers and technicians, including assignees from all member companies. The RTC establishes the technical foundation and processes required to create photomasks for future generation semiconductors. This includes working with critical photomask equipment and materials suppliers to help define their technology roadmaps and to do early beta-site evaluation of their products.
"We recognized early on that the most efficient way to meet the advanced development and technology demands in our industry is through joint collaboration of mask engineers with semiconductor engineers in a dedicated development facility," said Preston Adcox, president and COO of DPI. "Renewing the RTC agreement through 2002 verifies that a collaborative research and development model is beneficial to all companies involved."
ECTC holds 50th conference
LAS VEGAS - May 21 through 24, in the comfort of Caesars Palace (safely protected from the scorching desert sun and more than 100° temperatures), the Electronic Components, Assemblies and Materials Association (ECA), the Components, Packaging and Manufacturing Technology Society (CPMT), and the Institute of Electrical and Electronics Engineers (IEEE) jointly sponsored the 50th Electronic Components and Technology Conference (ECTC). More than 1,300 attendees (40 percent of whom were international visitors) gathered to listen to almost 300 technical papers in 38 sessions, which were presented by engineers and scientists from 20 countries. Recurring themes at the conference included environmental issues (such as lead-free initiatives), flip-chip technologies, thermal management, opto-electronics, automation and underfill materials.
 ECTC attendees exemplify the spirit of sharing and collaboration at the Technology Corner. |
In addition to the technical sessions was a Technology Corner exhibition, featuring approximately 75 booths occupied by an array of manufacturers and designers of cutting-edge products and technologies. In the midst of the exhibitors were nearly 50 poster exhibits presented by a host of scientists and engineers. Among the poster presenters were several graduate student researchers who chose ECTC 2000 as one of the first venues for showcasing their professional work.
The 51st ECTC will be held May 29 through June 1, 2001 at Wyndham Palace Resort and Spa in Lake Buena Vista, Florida. You are invited to submit papers that provide information on new developments, technology and knowledge in the following areas:
- Advanced packaging: New packaging technologies, designs, materials and configurations addressing performance density and cooling for single and multi-chip packages. Special emphasis on flip-chip, fine pitch and high lead-count packaging in CSP, BGA, CGA, LGA and SMT packages.
- Components and RF: New passive or active component technologies, integrated/embedded components, RF and wireless component applications, component performance, systems and reliability.
- Connectors and contacts: New or improved devices or techniques, emphasis on high density and performance for multi-chip, surface mount applications, WLBI and automotive.
- Education: Education for engineering curricula in the 21st century and collaborative research and engineering programs between universities, government or industry.
- Interconnections: First-level electronic interconnection technologies, including flip chip, wire bonding, TAB and conductive polymers for temporary or permanent interconnects; wafer, device and substrate-level interconnection metallizations and MEMS interconnects.
- Manufacturing technology: Statistical process controls, ISO compliance, cost re-engineering and improvements, new robotics, tooling or equipment, early manufacturing involvement initiatives, yield and test innovations used to enhance manufacturing processes related to high-density substrates, packaging, chip bumping and integrated component technologies.
- Materials and processing: Adhesives, interconnection materials, ceramics, metals, composites and thermal materials.
- Modeling and simulation: Electrical, thermal, optical and mechanical modeling, simulation, characterization and packaging solutions.
- Opto-electronics: Packaging for fiber-optic modules, infrared wireless, consumer opto-electronics, flat-panel, projection and micro-displays, optical amplifiers, lasers, detectors, waveguides, OEICs, passive components and WDMs.
- Posters: Papers may be submitted on any of the listed major topics (this new trend in authoring papers is highly encouraged at ECTC).
- Quality and reliability: Assessment failure analysis, reliability testing and data analysis, accelerated models, qualification of components and systems, KGD incremental quality improvement and TQM.
You may submit a 500-word abstract by fax, mail or on the Web site, describing the scope, content and key points of the proposed paper to:
Wayne J. Howell, IBM, 1000 River Road, Essex Junction, VT 05452; 802-769-7016; Fax: 954-827-0575; E-mail: [email protected]; Web site: www.ectc.net.
Abstracts must be received by October 15. Please include your mailing address, business telephone number, facsimile number and e-mail address of presenting author(s), and affiliations of all authors. At the discretion of the program committee, abstracts submitted may be considered for poster sessions. Please note that abstracts may be submitted to the Web site on a trial basis only. Submissions should be in the preferred Adobe Acrobat (pdf), html or MS Word formats. WordPro and assi (text) formats are also acceptable. Please check the Web site for complete information on how to submit papers electronically.
Internet marketplace for semiconductor materials and services
CAMPBELL, CALIF. - A new start-up in Silicon Valley, SemiSales.com, has launched an Internet marketplace for semiconductor materials and services. The vertical portal, or "vortal," is currently in beta site operation, with a full launch expected at Semicon West in July.
SemiSales.com has received funding from investors that include leaders from both the e-commerce and semiconductor industries. Investors include Bill Coleman, founder and CEO of BEA Systems (which provides software that enables e-commerce transactions for E-Trade and Amazon.com), Davidi Gilo, founder and CEO of DSP Communications (sold last year for $1.6 billion to Intel), and Bob Wall, founder and CEO of MIPS.
To promote e-commerce for buyers, SemiSales.com will provide specialized content information required to make an informed purchase decision, as well as offering a number of supplier management tools. Specialized content examples include supplier profiles, market information, quality data and supplier management reports. SemiSales.com hopes to put together the right mix of content, dialog, services and transaction processing to reflect the industry's practices.
While chip manufacturers provide the enabling components of the Internet, many of the companies in the supply chain (materials, services and equipment) are just beginning to advance their own e-commerce initiatives. The vast majority of commerce is still done primarily with brochures, faxes and sales calls. Products and services for this market are highly specialized and require careful reviews, not only from purchasing groups but also from engineers and managers who are involved in the decision. Early attempts to provide e-commerce to this market have focused on standard online catalog purchasing, which only covers a portion of the buyer's procurement needs. The philosophy of SemiSales.com is to provide the venue that allows supplier companies to differentiate their abilities and products; the goal is to enable better-informed purchasing and sourcing decisions from buying companies.
Suppliers on the SemiSales.com site pay fees for e-commerce services that result in higher sales because of increased exposure, reduced channel costs and better services to their customers. Buyers will use the site as a trusted collector of suppliers that offers new sourcing options and special buys. The site will offer a window of opportunity for new suppliers in the marketplace and provides information that speeds the qualification process. There is also a plan to offer electronic purchasing via online catalogs, automated requests for proposal, auctions of excess products and available manufacturing capacity.
No software installation is required, and there are no costs to the buyers. For more information, visit www.semisales.com. Look for more details at the worldwide product launch, set for July 10 through 12, 2000, at the San Francisco Marriott during Semicon West.
House votes for PNTR status for China
WASHINGTON, D.C. - The U.S. House of Representatives has recently approved Permanent Normal Trade Relations status (PNTR) for China, a critical requirement for ensuring fair and open access to markets upon China's accession to the World Trade Organization. "This historic vote was an absolutely critical step towards bringing China into the world trading community and towards expanding business opportunities there," said Stanley Myers, president of Semiconductor Equipment and Materials International.
The market for semiconductor equipment in China is expected to nearly quadruple over the next three years, from just over $1 billion in 1999 to $4 billion in 2003. With China's pledge to sign the Information Technology Agreement, reducing tariffs on equipment from a high of 40 percent today to zero by 2005, the market for equipment has the potential for even greater expansion. Myers went on to note, "China's semiconductor production currently meets only about 20 percent of domestic demand, so there is a tremendous opportunity to build the equipment market there as China grows its chip production capacity."
CMP provides ARM to academic institutions
GRENOBLE, FRANCE, and CAMBRIDGE, UK - Circuits Multi-Projets (CMP) and ARM Ltd. have finalized an agreement that enables CMP to provide academic institutions with a complete solution for developing ARM core-based system-on-chip (SOC) devices. This program, which is being driven by the industry's growing demand for SOC expertise, will provide universities with access to ARM core-based silicon and development tools, enabling engineering students to gain the skills and experience necessary to develop sophisticated integrated circuits and systems.
"As the system-on-chip trend continues to gain momentum, additional requirements and expertise will be expected of system developers and IC designers," said Eric Lalardie, business development manager at ARM.
CMP is a technology broker, providing academic institutions with the products and support necessary to equip a university training program or research and development facility. Through this program, the company will provide the ARM Developer Suite (ADS Unix and PC versions), a range of ARM evaluation boards and the Multi-ICE debug unit. CMP will also provide sample silicon from key ARM silicon partners.
"As deep submicron processes rapidly lead to system-on-chip solutions, microelectronics engineers are rapidly becoming system developers, mastering hardware-software implementation for novel silicon architecture," said B. Courtois, director of CMP. "With this agreement with ARM, CMP will be well placed to supply academic institutions worldwide with products that will greatly help future engineers to gain these necessary competencies."
ARM also works directly with universities, including Manchester University (UK), University of California at Berkeley (US), Université Catholique de Louvain (Belgium) and Aachen University (Germany), to promote core-related research.
MEPTEC and Advanced Packaging co-sponsor second annual Micro Electronics Packaging Technologist Award
MOUNTAIN VIEW, CALIF. and NASHUA, N.H. - The MicroElectronics Packaging and Test Engineering Council (MEPTEC) and Advanced Packaging magazine are pleased to announce that they will again co-sponsor the MicroElectronics Packaging Technologist Award. Started in 1999, the award was developed to recognize individuals who have played an integral role in the development of a technology that has pervasively enabled advances in the field of packaging or assembly of semiconductor ICs. The recipient will be a person (or persons) who have been involved with developing technologies that have positively impacted the back-end of the semiconductor industry in a way that has resulted in breakthrough, revolutionary events in the areas of packaging and assembly. The criteria for the award stipulate that the person(s) must have been involved in a development that had impact on the industry in terms of:
- Pervasiveness of the technology,
- Enabling of advances in the field of packaging or assembly of semiconductors, and
- Cost reduction coupled with improved reliability and concepts that allow breakthrough, revolutionary events.
There were two co-recipients in 1999. Maniam Alagaratnam of LSI Logic was recognized for pioneering and successfully qualifying high-performance flip-chip laminate packages for the semiconductor industry. He was a primary influence in developing the crucial infrastructure to support such technology, driving substrate and materials technology to a level that made flip chip a reality for the semiconductor industry. Also honored was Tom DiStefano, Ph.D., of Decision Track Technology Innovations for inventing and driving the force behind the development and market introduction of the MicroBGA CSP.
This year's award will be presented to the recipient(s) during a luncheon on October 4, 2000, during the MEPTEC Symposium, which will be held as part of PackCon 2000. PackCon 2000 is a newly formed exposition and technical conference that is a joint effort between MEPTEC, SEMI and CPMT, and will be held October 2 through 4 at the Santa Clara (Calif.) Convention Center. PackCon will focus on silicon-to-system packaging integration and will highlight leading-edge semiconductor packaging technology and applications.
"It only makes sense for organizations to work together at a time when there are many expositions and conferences from which the semiconductor packaging professional must choose. We are proud that our organizations can work together by co-sponsoring activities such as awards and conferences," said Bette Cooper, MEPTEC's director. "By joining forces with SEMI and CPMT on the expo and conference and Advanced Packaging on the award, we hope to create a powerful alliance that will give our members, attendees and readers a sense of the importance of the packaging, assembly and test segments of the semiconductor industry."
"It is with great pleasure that Advanced Packaging teams up with MEPTEC once again to sponsor this prestigious award," said John Bubello, publisher of Advanced Packaging. "The philosophy that drives the MicroElectronics Packaging Technologist mirrors the overarching aims of Advanced Packaging magazine: We strive to foster, celebrate and share outstanding feats and efforts in semiconductor packaging technology."
To nominate someone for the MicroElectronics Packaging Technologist Award, please fill out the nomination form at www.mepteconline.com by Sept.1. For information on PackCon 2000, visit www.semi.org or www.mepteconline.com.
Briefs
Everett Charles acquires PrimeYield Systems
Pomona, Calif.-based Everett Charles Technologies has acquired PrimeYield Systems Inc., a manufacturer of test contactors and the North American distributor of Micronics Japan Co. probe cards for semiconductor testing. Everett Charles, a subsidiary of Dover Corp. and a global provider of test fixtures, test equipment for bare substrates, pogo pins and semiconductor test interface products, will make PrimeYield Systems a part of its Semiconductor Test Group.
Solectron acquires Ericsson's operations in France, Sweden
Solectron Corp., a supply-chain facilitator for customized electronics technology, manufacturing and service solutions based in Milpitas, Calif., has completed the acquisition of the complex systems manufacturing assets of Ericsson's telecommunications infrastructure equipment operations in Longuenesse, France, and Ostersund, Sweden. As part of the agreement, Solectron will provide a range of integrated supply-chain solutions to Ericsson, including supply-base management, early prototyping, new production introduction management, PCB assembly, configure-to-order and build-to-order complex systems assembly, and global services.
Flextronics to acquire Uniskor
Flextronics International Ltd., San Jose, Calif., has entered into an agreement to acquire Uniskor Ltd., an Israel-based full-service electronic manufacturing services provider specializing in telecommunications, networking and wireless communications. The acquisition of Uniskor increases Flextronics' presence in Israel as well as the range of services the company is able to offer customers in this region. Under the terms of the agreement, worth approximately $20 million, Flextronics will acquire Uniskor's 8,000-square-meter facility in Migdal Haemek, Northern Israel, and will retain the 500-person workforce.
Morgan Advanced Ceramics introduces new business unit
Morgan Advanced Ceramics, a supplier of ceramic components and assemblies for medical, telecommunications, semiconductor and aerospace markets, has formed a new semiconductor equipment industry unit, Morgan Semiconductor Products. Formed on April 1, 2000, and based in California's Silicon Valley, the new unit sells a range of solutions geared toward the semiconductor industry, including ceramic and carbon materials, organic coating, ceramic/metal assemblies and e-chucks.
Technology review analyzes the micromachines industry
According to RDMI-99 Microtechnology Industry Review, a publication released by Norwalk, Conn.-based Business Communications Co. Inc. (BCI), the total anticipated market for MEMS, micromachines and microsystems is expected to reach $6.4 billion by 2002, with an AAGR of 21.6 percent increasing from an estimated $3.6 billion in 1999. Although medical, telecommunications and automotive applications will make the strongest showing in the market, the study says, healthy growth is projected overall.
The publication costs $1,750 and is available from BCI at 25 Van Zant St., Norwalk, CT 06855; 203-853-4266, Ext. 309; Fax: 203-853-0348; E-mail: [email protected].
GenRad acquires two sister companies
GenRad Inc., Westford, Mass., has acquired San Diego-based Nicolet Imaging Systems and its sister company, Sierra Research and Technology Inc., based in Westford, Mass., from ThermoSpectra Corp., a subsidiary of Thermo Instrument Systems Inc., for a combined purchase price of $40 million. The acquisition expands the range of test solutions GenRad provides to electronics manufacturers to include manual and automated X-ray inspection, as well as rework and repair. The expanded product portfolio allows GenRad to offer electronics manufacturers closed-loop test and repair solutions.
ViTechnology, Cognex enter into OEM agreement
Haverhill, Mass.-based ViTechnology, manufacturer of automated optical inspection equipment, has entered into an OEM agreement with Cognex Corp., a supplier of machine vision systems. Under the agreement, ViTechnology will employ the Cognex MVS-8000 vision-processing hardware and the company's software technology for locating and inspecting objects despite changes in angle, size or appearance. Cognex also will provide software-programming assistance with vision-processing-related applications. ViTechnology is releasing this new technology as Vectoral Imaging.
E-commerce companies provide single online source
TheSupply.com, a San Jose, Calif.-based net marketplace dedicated to automating materials and components supply chains, and NexPrise Inc., a provider of business-to-business exchanges for the collaborative value chain, have announced a strategic alliance. The companies intend to create a one-stop solution for semiconductor manufacturers, enabling centralized collaborative product development, sourcing, ordering, transaction capabilities, ERP integration, RFQ, billing, shipping, tracking and vendor-management services, all from a single, secure business-to-business exchange.
NETA announces American National StandardThe International Electrical Testing Association (NETA) announced publication of an American National Standard: ANSI/NETA ETT-2000 Standard for Certification of Electrical Testing Technicians. Those responsible for placing electrical power equipment into service or for assuring its continued reliability can now specify the use of certified electrical testing technicians, referencing the ETT Standard in its entirety. As an American National Standard, it has undergone due process, consensus and other stringent review requirements. ANSI/NETA ETT-2000 provides a nationally recognized procedure for qualifying electrical testing technicians and the agencies that certify them by defining competency based on experience, education and a certifying examination.
Newsmakers
 Dr. Alex Beavers |
People
Thomson Industries Inc., Port Washington, N.Y., has named Dr. Alex N. Beavers, Jr. as chief executive officer. Beavers succeeds John B. Thomson, Jr. in the position.
 Dr. Hugo Pristauz |
Datacon Semiconductor Equipment GmbH, Radfeld, Austria, has appointed Dr. Hugo Pristauz to director of advanced technology.
Newbury, Ohio-based Kinetico Inc. has named Scott Ullman as mechanical engineer of its industrial group.
Geltech Inc., Orlando, Fla., announced that Dr. Peter Schultz has been elected to the position of vice chairman.
Vitronics Soltec, Stratham, N.H., has appointed Jeroen Schmits to president. Schmits succeeds Michiel van Schaik. In addition, Marc Dalderup has rejoined the company as sales director for North and South America.
U.S.-based trade association IPC has given Dr. Ken Suetsugu of Panasonic Factory Automation Co., Franklin Park, Ill., an IPC Special Recognition Award for his achievements in the development of lead-free technologies.
Juki Automation Systems Inc., Morrisville, N.C., has named Robert Black, Jr. as chairman of the board and chief executive officer, and David Frac as chief financial officer.
San Jose, Calif.-based Exsil Inc. has appointed Roy Cutler to president.
Companies
Aegis Industrial Software Corp. has opened new, larger headquarters in northwest suburban Philadelphia. The new facility, located at Two Walnut Grove Drive, Suite 190, Horsham, PA 19044, will serve as the worldwide product development, customer support and product demonstration center, and provide a dedicated training center.
Austin, Texas-based 3M announced the separation of its Electronic Products Division into two divisions that reflect the differences in market focus and technologies of two long-standing operating units. As a stand-alone division, the new Interconnect Solutions Division will focus on customers and resource allocation.
GEL-PAK, Sunnyvale, Calif., has received ISO 9002 certification.
Aavid Thermal Products Inc., Concord, N.H., a wholly-owned subsidiary of Aavid Thermal Technologies Inc., changed its name to Aavid Thermalloy LLC. The new name reflects the company's recent acquisition of Thermalloy Inc., formerly a subsidiary of Bowthorpe Ltd.
ViTechnology LLC, Haverhill, Mass., has opened a 2,000-square-foot facility in Singapore that will serve as the Asia/Pacific sales, service, training and demonstration center.
Singapore-based Speedline Technologies Asia has integrated the products and services of Specialty Coating Systems (SCS) into its equipment family and now comprises five divisions.
Hayward, Calif.-based EKC Technology Inc. announced that it has obtained exclusive rights under a license with Simon Fraser University of Canada to commercialize a patented process that uses light in combination with metallic compounds to directly deposit metal and metal oxides on a substrate.
Universal Voltronics Corp., Mount Kisco, N.Y., has received ISO 9001 certification.
Boldt Metronics International Inc. (BMI) has opened its first international headquarters and manufacturing cell in Europe. BMI GmbH will be located in Berlin, Germany.
Remtec Inc., Norwood, Mass., has expanded its manufacturing facilities to 30,000 square feet and doubled its capacity to produce metalized ceramic substrates, chip carriers and packages.
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