Combo Memory agreement

04/01/2000

APack Technologies Inc., the first wafer bumping and flip chip foundry service provider in Taiwan, signed a memorandum of understanding (MOU) with Itochu Corp., Linvex Finet Japan and Siix Corp. for joint development and promotion of Combo Memory to the worldwide market. The Combo Memory module stacks SRAM and flash memory components to fulfill the small form-factor requirement of wireless communication handsets. According to the MOU, APack will provide its packaging design and manufacturing knowledge of bare die flip chip technology, while Itochu will secure the sources of SRAM and flash wafers. Mass production of Combo Memory is scheduled for the first half of this year.