ECTC meets in Las Vegas

04/01/2000

The Electronic Components and Technology Conference (ECTC) will celebrate its 50th anniversary May 21-24 at Caesar`s Palace in Las Vegas. The conference is expected to attract more than 800 designers, engineers and technical managers from the packaging, components and materials segments of the electronics industry. The meeting features more than 300 technical papers, short courses, a review of educational programs and initiatives in packaging, and a technology corner featuring exhibits by leading vendors. More than 75 papers will focus on the current state of the art in flip chip, wafer-level and chip scale packaging, MCM, BGA, MEMS packaging and bonding technology, and emerging technologies. Sessions will also be offered on materials and processing, modeling and simulation, quality and reliability, and opto-electronics packaging and assembly. For more information, visit www.ectc.net or contact Jim Bruorton at 864-963-6621.