SMTA International 2000 comes to Chicago

04/01/2000

NORWALK, CONN. - The Surface Mount Technology Association (SMTA) is moving its flagship technical conference, SMTA International 2000, to the Rosemont Convention Center near Chicago. The show will take place September 24-28. Assembly Technology Expo will also relocate to the Rosemont Convention Center and will be held September 26-28.

"Our strongest chapters are in Ohio, Atlanta and Minneapolis," said Mike Buseman, SMTA vice president of membership. "So the location of Chicago, in the heart of a major manufacturing region with easy direct access both domestically and internationally, will serve a greater number of SMTA members."

Greg Evans, SMTA president, said, "Members have long requested a greater SMTA presence in the East and Midwest, and fulfillment of contractual obligations in San Jose, [Calif.], offers the opportunity to move SMTA International for the benefit of all members." He added, "There is a lot of synergy between ATExpo and SMTA. We will nurture this new link . . ."

Industry professionals are invited to submit a paper for SMTA International. Papers are sought in the following key technology tracks:

- Components - BGAs and LGAs, fine-pitch leaded technology, CSPs, COB, multi-chip modules, advanced packaging applications, standardization, surface mount connectors, lead/termination finish, component solderability, and tape-and-reel

- Business - contract manufacturing, operations management, capacity modeling, structured problem solving, continuous improvement, total quality management, supplier management, technology roadmaps and environmental issues

- Assembly - printing process, dispensing process, solder paste, adhesives, flux and solder, placement process, reflow soldering, wave soldering, selective soldering, lead-free soldering, cleaning process, process control, inspection and test, yield improvement, rework and repair, facility layout, and equipment selection

- Substrates - design for excellence, land pattern geometry, HDI, micro and advanced via technologies, advances in substrate materials, advances in line and space definitions, advances in small module or BGA and CSP interposer substrates, soldermask, substrate surface finish and solderability, and substrate reliability

- New focus areas - automotive electronics, medical electronics and industrial controls.

For more information, contact JoAnn Stromberg at 612-920-7682 or e-mail [email protected].