Electrically Conductive Adhesive

04/01/2000

Epo-Tek EE165-3 is a silver-filled, electrically conductive adhesive designed as a solder replacement for SMT, hybrid microelectronics and other electronic assembly applications. The product provides the electrical and physical stability of a solder joint and is a viable low-risk, lead-free alternative for SMT joining applications, such as mounting passive components, chips and plastic packages to PCBs. Its low process temperature makes it a good candidate for flex circuits and temperature-sensitive ASICs.

Epoxy Technology Inc.

Billerica, Mass.