Die Attach Adhesives

04/01/2000

ZipCure can be cured on the pre-heat stage of wire bonders, eliminating the need for oven curing without compromising adhesion, stability or reliability. Its epoxy siloxane chemistry provides low moisture absorption, which prevents popcorning. Repeated exposure to extreme humidity at elevated temperatures throughout a device`s life will not degrade the adhesive`s initial properties, including its high bond strength.

A second new adhesive, DryBond, is for the assembler who needs high moisture resistance from a die attach adhesive that will drop right into an existing, conventional process. Both products are solid single-component, silver-filled formulations that are suited for bonding semiconductor die to lead frames and BGA substrates. A low modulus for any CTE reduces stress between the die and the substrate during thermal cycling, enhancing reliability.

Advanced Polymer Solutions

a Kulicke & Soffa Industries company

Willow Grove, Pa.