Film Adhesives

04/01/2000

ESP8680-WL and ZEF8150-WL adhesive films are dry to touch and can be stored in ambient temperatures for more than 12 months. They require minimal pressure using a wafer/frame film applicator or heated rubber roll laminator to achieve void-free tacking of film adhesive onto wafer at 80 to 100°C. Once die is placed and tacked onto the substrate, the assembly may be post-cured without pressure, much like traditional die-attach adhesives. The films are self-supporting continuous film without fiberglass mesh or carriers. ESP868-WL is designed for large and small die, with the capability of curing at 100°C for less than 30 minutes. ZEF8150-WL is designed for flip-chip application with anisotropic conductive properties.

AI Technology Inc.

Princeton, N.J.