Solventless Epoxies

04/01/2000

Epoxies thinned with solvents may weaken performance, separating into a liquid phase during curing, in turn leaving bubbles that weaken the bond or downgrade electronic and thermal performance. Metech has announced new epoxies that are solventless. They are compounded with reactive diluents incorporated into the film during the curing process. PCD 40073 is a fast-cure, thermally conductive, insulating epoxy for application on a wide range of substrates, including ceramics, glass, phenolic, epoxy printed circuit boards and porcelain enameled steel. Cured 40073 film offers protection against thermal shock, moisture, abrasion, oxidation and corrosion. PCD 40074 is designed for optimum heat transfer. Both epoxies can be applied by screen printing or syringe. PCC 40072 is a two-part copper-loaded conductive epoxy with high bond strength to many types of materials, such as epoxy laminate circuit boards, copper, solder, and glass. It has good electrical and thermal conductivity, and can be dispensed through a syringe or a stencil. All three compounds can be cured in two minutes at 200°C.

Metech, Inc.

Elverson, Pa.