FCT signs flip chip license

03/01/2000

Flip Chip Technologies (FCT) LLC, a joint venture of Kulicke & Soffa Industries and Delphi Delco Electronics Systems, has signed a 10-year technology transfer agreement with Siliconware Precision Industries Co. Ltd. (SPIL). SPIL will use FCT`s proprietary flex-on-cap wafer bumping and redistribution technologies to manufacture advanced flip chip packages at its Taichung, Taiwan, assembly facility.