Call for papers on lead solder alternatives

03/01/2000

PORTSMOUTH, R.I. - The Military and Aerospace Electronics Committee of the ASME Electrical and Electronic Packaging Division has announced a workshop on the use of lead solder alternatives in military electronics. The workshop will be held during the 2000 International Mechanical Engineering Congress and Exposition, November 5-10, at the Walt Disney World Dolphin Resort. Papers are requested to discuss or present concerns, issues or work addressing this topic. Suggested technical topics include: selection and/or validation methodologies of alternative materials, characterization of non-lead alternative materials under severe environments, and mechanical or physical test data of alternative materials. Suggested programmatic topics include: the effect non-lead solders will have on the design and manufacturing of military equipment, viewpoints from U.S. national labs and/or DoD labs, and integration of COTS equipment concerns using non-lead alternatives. Abstracts are due March 31 and final papers or presentations are due June 1. Address questions and submissions to A. J. Rafanelli, Product Applications Section-MS 133, Raytheon Co. Electronic Systems, 1847 West Main Road, Portsmouth, RI 02871; E-mail: [email protected].