Letter to the Editor

03/01/2000

Dear AP Editor:

I was pleased to see the results of the Third Annual Semi Dice Inc. Bare Die Survey featured in the pages of the November/December issue of your magazine ("CSP No Match for Bare Die"). I want to clarify the results on the survey as they relate to Chip Scale Packaging. CSP is certainly a viable packaging option and has a bright future. The survey results clearly indicate that CSPs will have little impact on the Bare Die Market.

Mitch Myers

President and COO

Semi Dice Inc.